Semiconductor Package Indicator for Distance Measurement
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Solution Overview
Problem
Current semiconductor package technologies face challenges in accurately measuring the distance between a semiconductor chip and the side surface of the package, especially after fabrication, due to the opaque materials used, which complicates the evaluation of package reliability and can lead to reduced margins, moisture infiltration, and delamination issues.
Innovation Solution
Incorporating an indicator within the semiconductor package that exposes a side surface with varying width or number of indicating blocks, allowing for non-destructive measurement of the distance between the chip and the package surface without using X-ray analysis, by calculating the distance based on the indicator's geometry or block exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If destructive analysis technique or non-destructive analysis technique using X-ray is used to obtain information on positions of semiconductor chips, then measurement accuracy is improved, but manufacturing complexity and time consumption increase
Solution Approach 1:
An indicator structure is introduced as an intermediary element between the semiconductor chip and the package side surface. This indicator includes a reference surface and a measurement surface with varying width, allowing direct optical measurement of the distance without requiring complex X-ray equipment or destructive analysis. The indicator mediates the measurement process by providing visible geometric features that correlate to the chip position.
Solution Approach 2:
The indicator creates a simplified geometric copy or representation of the distance information. Instead of directly measuring the chip position through complex techniques, the indicator provides a scaled or proportional visual representation through its varying width, which can be easily measured and correlated to the actual distance using simple formulas.
2Reliability
If opaque encapsulant material is used to cover the semiconductor chip, then package reliability is improved, but measurement capability deteriorates
Solution Approach 1:
The measurement function is segmented from the chip itself and transferred to a separate indicator structure. The indicator is divided into a reference surface (aligned with the chip) and a measurement surface (with varying width for measurement). This segmentation allows the opaque encapsulant to cover the chip while the indicator provides measurable features for distance determination.
Solution Approach 2:
The solution moves the measurement from a direct vertical measurement through the opaque encapsulant to a lateral measurement along the side surface of the package. The indicator's width varies in the lateral direction, providing measurable geometric features that can be observed from the side without penetrating the opaque encapsulant material.
3Productivity
If the distance between semiconductor chip and package side surface is reduced to shrink package size, then productivity is improved, but reliability deteriorates due to moisture infiltration and delamination
Solution Approach 1:
The indicator is pre-configured with specific geometric features (varying width, reference surface alignment) during package fabrication. This preliminary setup enables later measurement and verification of the chip position and distance, allowing quality control to identify packages with insufficient margins before they fail due to moisture infiltration or delamination.
Solution Approach 2:
The indicator provides visual feedback about the chip position and distance to the package side surface. By measuring the width of the indicator at different positions, one can determine whether the distance margin is sufficient. This feedback mechanism enables sorting of good packages from failed ones based on measured distance criteria.
Data Source
AI summary
A semiconductor package may include a package substrate to which a first semiconductor chip is attached, an encapsulant covering the first semiconductor chip, and an indicator disposed within the semiconductor package. A side surface of the indicator is exposed at a side surface of the semiconductor package, and a width of a vertical section of the indicator parallel with the exposed side surface of the indicator varies as the vertical section of the indicator becomes farther from the side surface of the semiconductor package.