Semiconductor IC Shielding Against Electromagnetic Induction
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Solution Overview
Problem
Semiconductor devices experience failures due to electromagnetic induction caused by the formation of an antenna loop between the semiconductor IC and capacitor elements, leading to induction currents that can disrupt the semiconductor IC's operation.
Innovation Solution
A semiconductor device design that includes a semiconductor IC, a capacitor element, and conductors connecting them, with the conductors and terminals positioned within a support region to form a loop antenna that is enclosed by a sealing body, where the support region blocks external magnetic flux, reducing electromagnetic induction effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductors connect the capacitor element terminals with the semiconductor IC terminals, then electrical connection is established, but electromagnetic induction causes induction currents that lead to semiconductor IC failures
Solution Approach 1:
The patent applies the principle of converting harm into benefit by utilizing the sealing body to enclose the loop antenna structure. Instead of eliminating the conductive loop (which would eliminate the capacitor's electrical connection function), the invention encloses it within a sealing body that acts as a shield, converting the potentially harmful electromagnetic induction into a controlled environment where the harm is contained and mitigated. The sealing body transforms the harmful electromagnetic induction effect into a manageable situation where the induction currents are suppressed while maintaining the necessary electrical connectivity.
Solution Approach 2:
The sealing body serves as an intermediary element between the loop antenna structure and the external electromagnetic environment. It mediates the interaction by providing a protective barrier that reduces electromagnetic induction from external sources while allowing the internal electrical connections to function normally. This intermediary structure enables the system to maintain both electrical connectivity and electromagnetic shielding.
2Object-affected harmful factors
If the semiconductor IC and capacitor element are disposed close to each other on the die pad, then the antenna loop area is reduced, but the electronic connection still forms a loop antenna that generates electromagnetic noise
Solution Approach 1:
The patent applies dimensionality change by transitioning from a two-dimensional arrangement (minimizing loop area on the die pad surface) to a three-dimensional solution by enclosing the structure within a sealing body. This vertical dimension addition provides electromagnetic shielding that addresses the harmful effects of the loop antenna without requiring further reduction of the horizontal loop area, thus maintaining electrical connectivity while suppressing electromagnetic noise and induction currents.
3Reliability
If conductors are extended to connect the capacitor element with the semiconductor IC, then electrical connectivity is achieved, but the conductor length increases the antenna loop area and electromagnetic induction effects
Solution Approach 1:
The sealing body converts the harmful effect of extended conductor length (increased antenna loop area) into a beneficial configuration by enclosing the entire loop structure. The enclosure transforms the extended conductors from vulnerable antenna elements into protected electrical interconnects, where the sealing body's shielding effect compensates for and neutralizes the increased electromagnetic induction risk associated with longer conductor paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces induction currents and suppresses failures in the semiconductor IC by mitigating the effects of electromagnetic induction, thereby enhancing the reliability of the semiconductor device.
Implementation Method 1
the support region blocks external magnetic flux
Implementation Method 2
Electromagnetic noise is generated by this loop-shaped antenna... electromagnetic induction arises in accordance with changes in magnetic flux passing through the loop-shaped antenna
Data Source
AI summary
A semiconductor device includes a semiconductor IC, a capacitor element, a support portion, a first conductor and second conductor, and a sealing body. The semiconductor IC has a first IC terminal and a second IC terminal. The capacitor element has a first terminal and a second terminal. The support portion supports the capacitor element and the semiconductor IC. The first conductor and second conductor extend so as to connect the first terminal and second terminal with, respectively, the first IC terminal and second IC terminal. The sealing body encloses the capacitor element, the semiconductor IC, the first conductor, the second conductor and the support portion. The first IC terminal and second IC terminal, the first terminal and second terminal, the first conductor and the second conductor are disposed at the inner side relative to an outer edge of the support portion.