Semiconductor Device Inductive Conductor Loop
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Solution Overview
Problem
Conventional semiconductor devices in power conversion systems face challenges in reducing inductance, surge voltage, switching loss, and electromagnetic radiation noise due to insufficient inductance reduction effects, particularly because the induced current is not effectively closed in a circular form and the supply terminals are often far apart, making it difficult to achieve significant inductance reduction.
Innovation Solution
A semiconductor device configuration with two semiconductor packages connected to an inductive conductor, where the current flows from the positive supply terminal to the negative supply terminal via an external output terminal in a circular form, inducing current in the inductive conductor to reduce inductance, surge voltage, and electromagnetic radiation noise. This is achieved by arranging the leads to be close to the inductive conductor, using a bent structure, and integrating the leads to form a continuous conductor frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the joint portion of the output terminal is placed away from the inductive conductor, then the device structure is simplified, but the inductance reduction effect is lost because induced current cannot flow
Solution Approach 1:
The patent extends the inductive conductor from a simple planar configuration into a three-dimensional folded structure that reaches down to the output terminal joint portion. This dimensional transformation allows the induced current to flow through a vertically extended path, closing the current loop effectively while maintaining structural simplicity.
Solution Approach 2:
The inductive conductor acts as an intermediary element that bridges the gap between the input terminal and output terminal. By folding the conductor to contact the output terminal joint portion, it creates an effective magnetic coupling path that enables induced current flow without requiring complex external wiring.
2Adaptability or versatility
If the supply terminals are arranged far apart, then the device can accommodate standard packaging, but the induced current cannot close in a circular form, reducing inductance reduction effectiveness
Solution Approach 1:
The inductive conductor is folded vertically to extend from the input terminal area down to the output terminal area, creating a three-dimensional current path. This vertical extension allows the induced current to close its loop effectively even when supply terminals are spatially separated in the horizontal plane, maintaining inductance reduction effectiveness while accommodating standard packaging layouts.
3Loss of energy
If the inductive conductor is extended to reduce inductance, then surge voltage and switching loss are reduced, but the device complexity increases
Solution Approach 1:
The inductive conductor is integrated directly into the device structure, merging the functions of electrical connection and inductance reduction into a single component. The folded conductor serves both as a structural element and as the inductive path, eliminating the need for separate inductance reduction mechanisms and reducing overall device complexity.
Solution Approach 2:
The inductive conductor performs multiple functions simultaneously: it provides electrical connection between terminals, generates induced current for inductance reduction, and serves as a structural framework for the device. This multi-functionality reduces the need for additional components, thereby reducing overall device complexity while achieving energy loss reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration effectively reduces inductance, thereby minimizing surge voltage, switching loss, and electromagnetic radiation noise, while also simplifying the connection process and mitigating stress on the semiconductor package.
Implementation Method 1
an inductance is reduced by making the current to be induced in an inductive conductor
Implementation Method 2
an induced current flows in parallel to a wiring conductor so that an inductance of the wiring conductor is reduced
Data Source
AI summary
A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.