Semiconductor Inductive Coupling via Nested Interconnect Layers
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Solution Overview
Problem
Existing semiconductor devices that use inductive coupling to transmit electrical signals between circuits with differing electrical potentials face challenges in downsizing and accommodating high-frequency signals, as the installation of inductors increases the device size.
Innovation Solution
A semiconductor device design featuring a multi-level interconnect structure with inductors placed face-to-face, where one inductor is connected to a first circuit and the other to a second circuit, allowing for efficient signal transmission while minimizing the device's size by integrating the circuit within the inductor structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If inductors are installed in interconnect layers to transmit electrical signals between circuits with differing electrical potentials, then signal transmission capability is improved, but device size increases
Solution Approach 1:
The patent places the first circuit region inside the first inductor and the second circuit region inside the second inductor when viewed in planar projection. This nesting arrangement allows the circuits to occupy the same spatial footprint as the inductors, thereby transmitting signals between circuits with differing electrical potentials without increasing the overall device area.
Solution Approach 2:
The patent utilizes the vertical dimension by forming inductors in different interconnect layers (first inductor in a first interconnect layer, second inductor in a second interconnect layer). This three-dimensional stacking approach enables signal transmission between circuits while maintaining a compact planar footprint, effectively transitioning from two-dimensional to three-dimensional space utilization.
2Adaptability or versatility
If photocoupler is used to transmit electrical signals between circuits with differing electrical potentials, then signal transmission is achieved, but device downsizing becomes difficult
Solution Approach 1:
The patent replaces the mechanical/optical system of a photocoupler (which requires light emitting and receiving elements) with an electrical inductive coupling system. By using inductors formed in interconnect layers through standard semiconductor manufacturing processes, the invention achieves signal transmission between circuits with differing potentials while enabling device downsizing and integration.
3Productivity
If inductors are placed face to face to transmit electrical signals, then signal transmission efficiency is improved, but device size increases
Solution Approach 1:
The patent achieves high signal transmission efficiency by placing inductors face-to-face in different interconnect layers while simultaneously maintaining compact device size through the nesting of circuits within the inductor footprints. This vertical stacking approach allows efficient magnetic coupling without requiring large planar separation distances.
Solution Approach 2:
The patent transitions from horizontal placement to vertical stacking by forming inductors in different interconnect layers. This three-dimensional arrangement enables face-to-face inductor coupling for efficient signal transmission while minimizing the planar area occupied, as the inductors overlap when viewed from above rather than being separated laterally.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively limits the size increase of the semiconductor device and enhances signal transmission efficiency by allowing the circuit to fit within the inductor structure, facilitating easier coupling and reducing the spacing between inductors.
Implementation Method 1
a technique which transmits an electrical signal by inductively coupling two inductors has been developed
Data Source
AI summary
A semiconductor device sends and receives electrical signals. The semiconductor device includes a first substrate provided with a first circuit region containing a first circuit; a multi-level interconnect structure provided on the first substrate; a first inductor provided in the multi-level interconnect structure so as to include the first circuit region; and a second inductor provided in the multi-level interconnect structure so as to include the first circuit region, wherein one of the first inductor and the second inductor is connected to the first circuit and the other of the first inductor and the second inductor is connected to a second circuit.