Semiconductor Device With Inductive Coupling And Twisted Pair Wiring

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Solution Overview

Problem

Existing semiconductor devices face challenges in achieving both electrical insulation and efficient signal transmission between chips, particularly due to disturbances caused by external magnetic fields, which require costly shielding solutions.

Innovation Solution

A semiconductor device design incorporating a first semiconductor chip with a coil that generates a magnetic field signal, a wiring board with a twisted pair wiring connecting coils, and a second semiconductor chip, where the coils are inductively coupled to transmit signals while minimizing noise interference by using short twisted pair wiring.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a wiring board with coils is used to transmit signals between electrically insulated semiconductor chips, then signal transmission is enabled, but external magnetic fields cause disturbances and noise

Engineering Contradiction:

Improvesignal transmission qualityVSAvoidmagnetic field disturbance

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies differential signaling where external magnetic field disturbances induce equal voltages in both signal lines, which are then rejected by the differential receiver. This converts the harmful magnetic field interference into a common-mode signal that is eliminated through differential processing, transforming the harm into a benefit by making the system immune to such disturbances.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent changes the signaling parameter from single-ended to differential mode. By using differential signaling with equal and opposite signal swings, the system achieves immunity to magnetic field disturbances while maintaining signal transmission capability between electrically insulated chips.

Inventive Principle:

Principle #35Parameter changes

2Object-affected harmful factors

If shielding is used to block external magnetic fields, then magnetic field disturbance is reduced, but device complexity and manufacturing cost increase

Engineering Contradiction:

Improvemagnetic field disturbanceVSAvoidshielding structure

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

Instead of using physical shielding to block magnetic fields, the patent converts magnetic field disturbances into common-mode signals that are rejected by differential processing. This eliminates the need for complex shielding structures while maintaining immunity to magnetic field interference.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent replaces the mechanical/physical shielding approach with an electrical/differential signaling approach. Instead of blocking magnetic fields physically, the system uses differential voltage signals that are inherently immune to magnetic field disturbances, simplifying the device structure.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Object-affected harmful factors

If twisted pair wiring is used to connect coils, then noise interference is reduced, but manufacturing precision requirements increase

Engineering Contradiction:

Improvenoise interferenceVSAvoidtwisted pair alignment

Core Design Contradiction:

Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The patent uses twisted pair wiring where external magnetic field disturbances induce equal voltages in both conductors. The twisting ensures that the loop area is minimized and the induced voltages are equal, allowing the differential receiver to reject the noise. This converts potential harmful interference into a rejectable common-mode signal.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables efficient signal transmission with reduced noise interference and eliminates the need for shielding, enhancing transmission efficiency and simplifying manufacturing processes.

Implementation Method 1

a first coil (21) that generates a magnetic field signal; a second coil (22), disposed to face the first coil (21), that receives the magnetic field signal generated by the first coil (21)

Methodology Applied

Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 2

a third coil (23) that generates a magnetic field signal; a fourth coil (24), disposed to face the third coil (23), that receives a magnetic field signal generated by the third coil (23)

Methodology Applied

Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS20230093818A1Semiconductor device

Publication Date: 2023.03.30 KK TOSHIBA

AI summary

A semiconductor device includes: a first semiconductor chip including a first coil that generates a magnetic field signal; a wiring board including a second coil, a third coil, and a twisted pair wiring, the second coil being disposed to face the first coil and receiving the magnetic field signal generated by the first coil, the twisted pair wiring connecting the second coil with the third coil; and a second semiconductor chip including a fourth coil disposed to face the third coil and receiving a magnetic field signal generated by the third coil.