Semiconductor Inductor Insulation Withstand Voltage
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Solution Overview
Problem
Semiconductor devices that transmit electrical signals between circuits with differing potentials face challenges in reducing size and maintaining insulation withstand voltage due to the limitations of existing inductive coupling techniques.
Innovation Solution
A semiconductor device with a multilayer wiring structure where at least two insulating layers separate first and second inductors, positioned in specific wiring layers to increase insulation withstand voltage, allowing for efficient signal transmission while maintaining a compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If inductors are formed in adjacent wiring layers with a single interlayer insulating film, then device size is reduced, but insulation withstand voltage between the inductors becomes insufficient
Solution Approach 1:
The patent transitions from a single-layer insulating structure to a multi-layer insulating structure by stacking additional insulating films between the inductors in adjacent wiring layers. This dimensional expansion in the vertical direction provides enhanced insulation withstand voltage while maintaining the compact horizontal footprint of the device.
Solution Approach 2:
The patent employs a composite insulating structure consisting of multiple insulating films with different materials and properties stacked together. This composite approach allows each layer to contribute different insulating characteristics, achieving superior overall insulation performance compared to a single homogeneous insulating layer.
2Reliability
If multiple insulating layers are added between inductors to increase insulation withstand voltage, then reliability improves, but device size and complexity increase
Solution Approach 1:
The patent integrates the multi-layer insulating structure into the existing wiring layer framework, combining the insulation function with the structural organization of multiple wiring layers. This merging approach allows the enhanced insulation to be achieved without creating a separate complex insulation subsystem.
Solution Approach 2:
The insulating layers serve multiple functions simultaneously: they provide electrical insulation between inductors, act as structural separators between wiring layers, and contribute to the overall device packaging. This multi-functionality reduces the need for additional dedicated components and simplifies the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The increased insulation withstand voltage enhances signal transmission efficiency and reduces the size of the semiconductor device, while maintaining manufacturing cost-effectiveness by utilizing existing semiconductor manufacturing facilities.
Implementation Method 1
a technique of transmitting an electrical signal by using inductive coupling between two inductors
Data Source
AI summary
A semiconductor device includes a substrate, a transistor formed over the substrate, insulating layers formed over the substrate, a multilayer wiring formed in the insulating layers, a first inductor formed in the insulating layers, and a second inductor formed over the first inductor and overlapping the first inductor. The insulating layers contain a silicon, wherein at least the two insulating layers are formed between the first inductor and the second inductor, and the first inductor and the second inductor are a spiral wiring pattern.