Semiconductor-Integrated Inductor Wire Layout for Thinner Components
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional inductor components with inductor wires formed on organic insulating substrates by electroplating result in increased thickness, limiting their miniaturization and performance.
Innovation Solution
An inductor component with a semiconductor substrate and a first inductor wire extending through the substrate, made from semiconductor material with lower electrical resistance, integrated with the substrate, along with additional features like insulating layers, external terminals, and connecting wires to reduce thickness and enhance performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If inductor wires are formed on organic insulating substrates by electroplating, then inductor components can be manufactured with conventional processes, but the thickness of the inductor component increases
Solution Approach 1:
The patent changes the substrate material from organic insulating substrate to semiconductor substrate, and changes the inductor wire formation method from electroplating to direct formation using semiconductor processing techniques. This parameter change enables thinner components while maintaining manufacturability through established semiconductor fabrication processes
Solution Approach 2:
The patent merges the substrate and inductor wire into a single integrated structure where the inductor wire is formed directly on the semiconductor substrate. This eliminates the need for separate electroplating steps and additional thickness from multiple layers, achieving thickness reduction while simplifying the manufacturing process
2Ease of manufacture
If inductor wires are formed on organic insulating substrates by electroplating, then conventional manufacturing processes can be used, but the component thickness increases limiting miniaturization
Solution Approach 1:
The patent transitions from organic insulating substrate to semiconductor substrate, enabling direct formation of inductor wires through semiconductor processing. This parameter change reduces component volume while maintaining process compatibility through standard semiconductor fabrication techniques
Solution Approach 2:
The patent forms inductor wires in the planar dimension directly on the semiconductor substrate surface, eliminating the need for thick vertical electroplating layers. This dimensional approach reduces the vertical thickness while maintaining the inductive function through optimized wire geometry
Data Source
AI summary
An inductor component comprising a semiconductor substrate made from a semiconductor material, the semiconductor substrate having a main surface; and a first inductor wire extending through the interior of the semiconductor substrate along the main surface. The first inductor wire contains the semiconductor material. Also, the first inductor wire has an electrical resistance lower than that of the semiconductor substrate and is integrated with the semiconductor substrate.