Semiconductor Inductor Placement for Non-Contact Wafer Testing
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Solution Overview
Problem
Conventional semiconductor devices face challenges in testing internal circuits at the wafer level due to poor connections and contamination from probe testing, and the need for multiple inductors for non-contact signal transmission/reception increases chip size and footprint.
Innovation Solution
A semiconductor device with a substrate, bonding pads, and a first signal transmitting/receiving portion below the bonding pads for non-contact signal transmission/reception by electromagnetic induction, allowing for efficient disposal of inductors and bonding pads without increasing chip size, and a method for manufacturing and testing that uses a tester apparatus for non-contact signal exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If probe testing is used for wafer-level testing, then power supply and signal transmission can be achieved, but pad scratching and contamination occur causing poor connection and reliability issues
Solution Approach 1:
The patent replaces the mechanical probe-pad contact system with an electromagnetic induction system. Inductors are formed in the insulating film above bonding pads, enabling non-contact power supply and signal transmission through electromagnetic coupling with external inductors, thereby eliminating mechanical scratching and contamination issues
2Reliability
If multiple inductors are provided for non-contact signal transmission/reception, then probe testing problems are avoided, but chip size and footprint increase
Solution Approach 1:
The patent merges the functions of multiple inductors into a single integrated inductor structure. The inductor is formed within the insulating film above bonding pads, utilizing the same structural layer for both mechanical support and electromagnetic function, thereby reducing the total area required compared to separate inductor components
Solution Approach 2:
The patent transitions from planar inductor layouts to a vertical three-dimensional structure by forming inductors within the insulating film layer above bonding pads. This vertical integration allows electromagnetic functionality to be achieved without increasing the horizontal chip footprint
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient non-contact signal transmission/reception, reduces chip size, and suppresses the increase in chip size by using inductors instead of probe pads for testing, allowing for compact and effective semiconductor device design and testing.
Implementation Method 1
a first signal transmitting/receiving portion provided above the substrate and below the bonding pad for carrying out signal transmission/reception to/from an external in a non-contact manner by electromagnetic induction
Data Source
AI summary
A semiconductor device includes a substrate, an internal circuit including a plurality of transistors provided over the substrate, an insulating film provided over the substrate, a bonding pad provided over the insulating film, an inductor being formed in the insulating film, the inductor carrying out a signal transmission/reception to/from an external device in a non-contact manner by an electromagnetic induction and being electrically coupled to the internal circuit. The inductor includes a first conducting layer, and the bonding pad includes a second conducting layer. The first conducting layer includes a lower level layer than the second conducting layer in a thickness direction of the substrate. In a plan view, the inductor includes a first portion overlapping the bonding pad and a second portion not overlapping the bonding pad.