Semiconductor Infrared Detector with Absorbing Gate Insulator
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Solution Overview
Problem
Far-infrared ray sensors with spatial light modulation types require complex optical mechanisms, leading to a cumbersome structure and high part counts, making them inefficient for infrared detection.
Innovation Solution
A semiconductor-based infrared detector with a source and drain region, an infrared-absorbing film as a gate insulating film, and a transparent gate electrode, which detects changes in dielectric constant due to temperature rises from infrared absorption, allowing for simpler configuration and detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a spatial light modulation type far-infrared sensor is used, then detection capability is achieved, but the structure becomes complicated and the number of parts increases
Solution Approach 1:
The patent extracts and eliminates the complex optical mechanisms from the far-infrared sensor system. By using a bolometer that directly detects infrared-induced temperature changes in a semiconductor substrate, the invention removes the need for spatial light modulation components, thereby simplifying the overall structure while maintaining detection capability.
Solution Approach 2:
The patent replaces the mechanical/optical spatial light modulation system with a direct thermal detection mechanism. The bolometer uses temperature-induced resistance changes in a semiconductor substrate to detect far-infrared radiation, substituting complex optical-mechanical systems with a simpler electrical-thermal detection approach.
2Stability of the object's composition
If a bolometer with Peltier cooling is used, then temperature stability is improved, but power consumption increases and weight increases
Solution Approach 1:
The patent employs a semiconductor substrate that inherently provides thermal stability through its material properties and structure. The substrate's thermal mass and conductivity naturally stabilize the operating temperature, eliminating the need for active Peltier cooling systems and their associated power consumption.
Solution Approach 2:
The invention changes the thermal parameters of the detection system by using a semiconductor substrate with specific thermal properties. This substrate provides adequate thermal stability for far-infrared detection without requiring the extreme temperature control and high power consumption of Peltier-cooled bolometers.
3Adaptability or versatility
If a solid element for photoelectric conversion is used, then detection wavelength range is improved, but cooling to liquid nitrogen temperature is necessary
Solution Approach 1:
The patent changes the operating temperature parameter from liquid nitrogen temperatures (77K) to room temperature or near-room temperature operation. The semiconductor substrate and bolometer design enable far-infrared detection at much higher temperatures, eliminating the need for cryogenic cooling while maintaining broad wavelength detection capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient detection of infrared rays with a simpler configuration, reducing power consumption, size, and cost, while providing improved sensitivity and durability compared to existing technologies.
Implementation Method 1
an infrared ray absorbing film as a gate insulating film formed on the semiconductor substrate
Implementation Method 2
detecting a change in a dielectric constant caused by a temperature rise due to absorption of infrared rays
Data Source
AI summary
An infrared detector includes a source region and a drain region which are formed on a semiconductor substrate, an infrared ray absorbing film as a gate insulating film formed on the semiconductor substrate, and a gate electrode which is formed of a transparent electrode for infrared rays on the gate insulating film, in which, when a predetermined voltage is applied to the gate electrode, a predetermined current flows between the source region and the drain region.


