Semiconductor Injection Device With Ionization And Self-Cleaning

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Solution Overview

Problem

Conventional semiconductor testing methods are inefficient and prone to human error, leading to inconsistent results and potential damage to semiconductor chips due to uncontrolled testing conditions.

Innovation Solution

An injection device with a built-in cleaning mechanism is developed, which includes a height-adjusting base, a reservoir, testing and cleaning pipes, and an electrode rod. This device automatically injects and ionizes a testing liquid onto a semiconductor chip, allowing for precise and controlled testing while minimizing contamination risks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If manual testing solution dripping is used, then operation simplicity is maintained, but testing precision and quality control deteriorate

Engineering Contradiction:
Improveoperation simplicityVSAvoidtesting precision
Core Design Contradiction:
Ease of operationVSMeasurement precision

Solution Approach 1:

The patent replaces the manual mechanical dripping operation with an automated injection device that uses a syringe mechanism and control system to precisely deliver testing solutions. The injection device includes a syringe, plunger, and control system that automatically control the amount and position of solution delivery, eliminating manual operation variability while maintaining ease of use through automated control.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Device complexity

If manual testing method is used, then device complexity is low, but testing efficiency and result reliability deteriorate

Engineering Contradiction:
Improvedevice complexityVSAvoidtesting efficiency
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The injection device incorporates a self-cleaning mechanism where a cleaning solution is automatically injected through the same syringe system after testing. The cleaning solution flows through the testing solution channel to flush and clean the internal passages, and the used cleaning solution is drained through a dedicated channel. This self-cleaning function eliminates manual disassembly and cleaning steps, significantly improving testing efficiency and reliability without requiring complex additional cleaning equipment.

Inventive Principle:
Principle #25Self-service

3Object-affected harmful factors

If testing solution is dripped manually, then contamination risk is low, but pollution risk to semiconductor elements increases

Engineering Contradiction:
Improvecontamination riskVSAvoidpollution risk
Core Design Contradiction:
Object-affected harmful factorsVSObject-generated harmful factors

Solution Approach 1:

The patent replaces manual dripping with an automated injection system that precisely controls solution delivery through a syringe mechanism. This mechanical substitution eliminates human contact with the testing solution and semiconductor elements, reducing both contamination and pollution risks. The system uses controlled injection and automated cleaning to ensure no residual testing solution remains on the semiconductor elements after testing.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Measurement precision

If automated injection device is used, then testing precision is improved, but device complexity increases

Engineering Contradiction:
Improvetesting precisionVSAvoiddevice complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent merges the testing solution injection function and cleaning solution injection function into a single integrated syringe system. The same syringe, plunger, and injection mechanism are used for both testing and cleaning operations, with different solutions loaded into the same reservoir. This merging reduces device complexity by eliminating duplicate injection mechanisms while maintaining high testing precision through automated control.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The injection device is designed with multi-functionality, where the syringe system can perform both testing solution delivery and cleaning solution delivery through the same mechanical components. The system automatically switches between testing and cleaning modes, and the same injection mechanism handles both functions, reducing overall device complexity while improving testing precision through consistent automated operation.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables automatic and accurate semiconductor testing, improving efficiency and precision while reducing the risk of pollution to semiconductor elements, thus enhancing the reliability of semiconductor chip testing.

Implementation Method 1

the electrode rod ionizes the testing liquid

Methodology Applied
Scientific EffectIonization: Ionisation

Data Source

PatentUS12313654B2Injection device, semiconductor testing system and its testing method
Publication Date: 2025.05.27 HERMES TESTING SOLUTIONS
  • US12313654B2 patent drawing
  • US12313654B2 patent drawing
  • US12313654B2 patent drawing

AI summary

An injection device is utilized to inject a liquid onto a test area of a semiconductor element. The injection device includes a height-adjusting base, a reservoir, a first testing pipe, a cleaning pipe, a liquid-draining pipe, and an electrode rod. The reservoir is provided with a dropping port. The dropping port is against the test area of the semiconductor element. The first testing pipe, the cleaning pipe and the liquid-draining pipe are connected to the reservoir. The electrode rod penetrates through the reservoir and contacts and ionizes a testing liquid. A semiconductor testing system utilizing the injection device and its testing method are also provided herein.