Semiconductor Inspection via UV-Cured Adhesive Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As semiconductor technology advances and feature sizes decrease, microscopic inspection of semiconductor device structures becomes increasingly challenging, making it difficult to identify and analyze yield-limiting, design-functional, and performance-limiting defects effectively.
Innovation Solution
A method involving thinning of the semiconductor die, marking the target region, applying a light curable glue, and using a carrier substrate to facilitate inspection, where the glue is cured with UV light to form an adhesive layer that supports the structure during inspection without thermal stress, allowing for precise examination of defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional microscopic inspection methods are used on small-featured semiconductor structures, then inspection capability is maintained at current levels, but inspection precision deteriorates as feature sizes decrease
Solution Approach 1:
The patent applies preliminary action by thinning the semiconductor die before inspection to make the target region more accessible and visible. This pre-processing step prepares the sample in advance, transforming it into a state that is easier to inspect while preserving the original structure's integrity for analysis.
2Strength
If thermal methods are used to support the semiconductor structure during inspection, then structural support is achieved, but thermal damage occurs to the device
Solution Approach 1:
The patent introduces an intermediary substance (adhesive material) that provides structural support without causing thermal damage. This mediator material bonds the semiconductor die to the carrier substrate, enabling stable mounting during inspection while avoiding the harmful thermal effects of direct thermal support methods.
3Ease of operation
If the semiconductor die is thinned to facilitate inspection, then inspection accessibility is improved, but structural integrity is compromised
Solution Approach 1:
The die thinning is performed as a preliminary action before inspection, creating an opening that exposes the target region while maintaining the overall structural integrity of the semiconductor device. This pre-prepared state enables easy inspection access without compromising the device's functional structure.
Solution Approach 2:
The adhesive material serves as an intermediary that provides mechanical support to the thinned die structure, compensating for the reduced structural integrity while enabling stable mounting during inspection. This mediator restores the necessary structural strength without requiring restoration of the thinned area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and precise identification of defects in semiconductor devices, reducing thermal stress and potential damage, thereby improving inspection accuracy and product yield.
Implementation Method 1
irradiating the polymer-containing solution with a light to transform the polymer-containing solution into an adhesive layer bonding the transparent substrate and the semiconductor device structure
Data Source
AI summary
A method for inspecting a semiconductor device structure is provided. The method includes receiving a semiconductor device structure having a to-be-inspected feature. The semiconductor device structure has a first surface and a second surface. The method also includes applying a polymer-containing solution over the first surface of the semiconductor device structure. The method further includes disposing a transparent substrate over the first surface of the semiconductor device structure and the polymer-containing solution. In addition, the method includes irradiating the polymer-containing solution with a light to form an adhesive layer between the transparent substrate and the semiconductor device structure. The adhesive layer bonds the transparent substrate and the semiconductor device structure. The method also includes inspecting the to-be-inspected feature.