Semiconductor Inspection Device Using Calibration-Based Image Interpolation
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Solution Overview
Problem
Current defect inspection methods for semiconductor devices face challenges in balancing sensitivity and throughput, particularly in resolving fine patterns with a half-pitch of approximately 10 nm, as light-based inspections struggle with resolution and electron beam inspections compromise on throughput.
Innovation Solution
An inspection device and method that generates a high-resolution secondary image from a low-resolution primary image using an interpolation function based on calibration samples, allowing for sensitive defect detection while maintaining high throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If inspection magnification is increased to improve sensitivity for fine patterns, then measurement precision is improved, but productivity decreases
Solution Approach 1:
The patent applies preliminary action by pre-calculating and storing correspondence relationships between low-resolution and high-resolution image data in advance. During actual inspection, the system retrieves pre-computed high-resolution correspondence data based on acquired low-resolution images, eliminating the need for real-time high-resolution processing and thus maintaining high throughput while achieving high sensitivity defect detection.
2Measurement precision
If electron beam inspection is used to resolve fine patterns with half-pitch of approximately 10 nm, then measurement precision is improved, but productivity decreases
Solution Approach 1:
The patent applies copying by creating and storing correspondence data that maps low-resolution image characteristics to high-resolution image features in advance. During inspection, the system copies or retrieves this pre-established correspondence relationship to generate high-resolution defect detection results from low-resolution input images, achieving fine pattern resolution without the computational overhead of real-time electron beam processing.
3Productivity
If light-based inspection is used to maintain high throughput, then productivity is improved, but measurement precision deteriorates for fine patterns
Solution Approach 1:
The patent introduces an intermediary approach by using low-resolution image data as a mediator to access pre-computed high-resolution correspondence relationships. The system acquires fast-to-obtain low-resolution images, then uses these as keys to retrieve corresponding high-resolution defect information from pre-stored data, thereby achieving both high throughput from the rapid low-resolution acquisition and high resolution from the pre-computed correspondence data.
Data Source
AI summary
An inspection device according to an embodiment includes a microscope, a storage section, an image processing section and an inspection section. The microscope is configured to obtain a primary image by capturing an inspection target. The storage section stores a function defining a relationship between a low-resolution image and a high-resolution image of a calibration sample. The high-resolution image has smaller pixel size than the low-resolution image. The image processing section is configured to generate a secondary image based on the primary image by using the function. The secondary image has smaller pixel size than the primary image. The inspection section is configured to inspect the inspection target using the secondary image.