Semiconductor Inspection Imaging for Timing-Based Drive Element Detection
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Solution Overview
Problem
The miniaturization of semiconductor devices leads to interference in detection signals due to light mixing from multiple drive elements, making it difficult to accurately identify their positions and perform failure analysis.
Innovation Solution
A method and apparatus that detect light from multiple positions in a semiconductor device, acquire waveforms corresponding to these positions, extract waveforms at specific timings, generate images based on brightness distribution correlations, and identify drive element positions using feature points, enhancing examination accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the semiconductor device is miniaturized to increase integration density, then the productivity and functionality are improved, but the detection precision of drive element positions deteriorates due to light interference from multiple elements
Solution Approach 1:
The patent segments the detection process by extracting waveforms at specific timing points corresponding to individual drive element operations. This temporal segmentation separates the mixed light signals from multiple drive elements, allowing precise identification of each element's position despite device miniaturization
Solution Approach 2:
The patent adds a time dimension to the spatial detection by analyzing waveforms at specific timing. This transforms the problem from a purely spatial overlap issue to a spatiotemporal separation problem, enabling precise position identification even when drive elements are closely spaced
2Area of stationary object
If multiple drive elements are closely positioned to reduce device size, then the area is reduced, but the reliability of failure analysis deteriorates due to inability to properly identify individual element positions
Solution Approach 1:
The patent performs preliminary waveform extraction at specific timing before conducting failure analysis. This preliminary temporal separation of signals ensures that individual drive element positions are identified with high accuracy, providing a reliable foundation for subsequent failure analysis even in miniaturized devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-accuracy examination and failure analysis by precisely locating drive elements within semiconductor devices.
Implementation Method 1
a photodetector that detects light from a plurality of positions in a semiconductor apparatus and outputs a detection signal
Data Source
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AI summary
A semiconductor apparatus examination method includes a step of detecting light from a plurality of positions in a semiconductor apparatus (D) and acquiring a waveform corresponding to each of the plurality of positions, a step of extracting a waveform corresponding to a specific timing from the waveform corresponding to each of the plurality of positions and generating an image corresponding to the specific timing based on the extracted waveform, and a step of extracting a feature point based on a brightness distribution correlation value in the image corresponding to the specific timing and identifying a position of a drive element in the semiconductor apparatus based on the feature point.