Semiconductor Inspection Using Multi-Angle LED Optical Cutting
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Solution Overview
Problem
Current semiconductor device inspection methods are inefficient in measuring the top surface height and inclination of metal members on semiconductor chips in a short time, leading to reduced product yield and increased manufacturing costs, as they typically require scanning linear inspection light beams to obtain three-dimensional information, which is time-consuming.
Innovation Solution
The method involves irradiating semiconductor chips or metal members with multiple linear beams of inspection light from different angles using LED projectors and capturing images with a CCD camera to calculate three-dimensional information using an optical cutting method, allowing for simultaneous measurement of top surface shape, height, and inclination across a wide area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If linear inspection light beams are scanned to obtain three-dimensional information, then measurement precision is improved, but inspection time increases
Solution Approach 1:
The patent projects inspection light beams in multiple directions (first direction and second direction) onto the inspection object simultaneously, capturing three-dimensional information by adding a dimensional aspect to the inspection process. This allows obtaining height, top surface shape, and inclination information without sequential scanning, thereby improving measurement precision while reducing inspection time.
Solution Approach 2:
The patent combines multiple inspection light beam projections at different angles into a single inspection process. By projecting beams from both first and second directions simultaneously and capturing images with a single sensor, the system merges multiple measurement operations into one, achieving comprehensive three-dimensional measurement without time-consuming sequential scanning.
2Productivity
If multiple inspection light beams are projected simultaneously, then productivity is improved, but device complexity increases
Solution Approach 1:
The patent divides the inspection light source into multiple independent LED projectors, each capable of projecting inspection beams in specific directions. This segmentation allows simultaneous multi-directional illumination while keeping each projector relatively simple in structure, thereby improving productivity without excessive increase in overall device complexity.
Solution Approach 2:
The inspection system uses multiple LED projectors that can function in different directions, making each projector multi-functional. The same type of LED projector can be configured for different projection angles, reducing the need for specialized components for each direction and managing device complexity while achieving high productivity through simultaneous multi-directional inspection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables rapid three-dimensional measurement of semiconductor chip and metal member surfaces, improving inspection precision and throughput, thereby enhancing product yield and reducing manufacturing costs by collectively obtaining information from different irradiation patterns.
Implementation Method 1
irradiating a semiconductor chip or a metal member with first inspection light having a plurality of linear beams parallel to each other from a first direction
Implementation Method 2
obtaining a first image of the semiconductor chip irradiated with the first inspection light or the metal member irradiated with the first inspection light
Data Source
AI summary
A semiconductor device inspection method according to an embodiment includes irradiating a semiconductor chip or a metal member with first inspection light having a plurality of linear beams parallel to each other from a first direction inclining with respect to a top surface of a substrate, the semiconductor chip being disposed on the substrate, and the metal member being disposed on the semiconductor chip; obtaining a first image of the semiconductor chip irradiated with the first inspection light or the metal member irradiated with the first inspection light; and calculating first three-dimensional information of the semiconductor chip or the metal member based on the first image by using an optical cutting method.