Semiconductor Inspection Device with Movable Member for Dual-Face Contact
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Solution Overview
Problem
Existing inspection devices for semiconductor integrated circuits with electrodes on two opposite faces face challenges in connecting both external electrodes simultaneously without increasing the overall size, limiting high-density stacking effects.
Innovation Solution
An inspection device with a configuration that includes a fixed member, a movable member, and a holding part, where the movable member moves to connect both external electrodes of the semiconductor integrated circuit to the inspection circuit board and wiring board, allowing for electrical connection without additional external electrodes, and impedance matching is achieved through characteristic impedance matching between the wiring board and the inspection circuit board or measuring device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a pogopin type conductive contact is used to connect external electrodes on two opposite faces, then electrical connection is achieved, but the overall size of the semiconductor integrated circuit becomes larger
Solution Approach 1:
The inspection device is divided into a fixed member and a movable member that can move relative to each other. The fixed member holds the semiconductor integrated circuit and includes a first conductive contact for the first external electrode, while the movable member includes a second conductive contact for the second external electrode on the opposite face. This segmentation allows independent access to both electrodes without requiring additional internal structures within the semiconductor device itself.
Solution Approach 2:
The inspection circuit board and wiring board serve as intermediary components that facilitate electrical connection between the external electrodes and the measurement system. The inspection circuit board includes land electrodes and wiring circuits that connect to both the first and second external electrodes, providing a mediation path that enables electrical connection without increasing the semiconductor integrated circuit's internal structure or size.
2Reliability
If inspection-use external electrodes are added to connect both faces, then electrical connection is achieved, but the number of external electrodes increases
Solution Approach 1:
The inspection circuit board is designed with multi-functionality to serve multiple purposes. It includes land electrodes that can connect to both the first external electrode on one face and the second external electrode on the opposite face through wiring circuits. This universal design allows a single inspection circuit board to handle connections for both external electrodes without requiring separate dedicated connection paths or additional external electrodes on the semiconductor device.
3Length of moving object
If the inspection circuit board is arranged in one direction, then electrical connection at shortest distance is achieved, but connection of external electrode on opposite face becomes difficult
Solution Approach 1:
The inspection circuit board is arranged in a planar configuration that extends in multiple directions relative to the semiconductor integrated circuit. The first land electrode is positioned to connect to the first external electrode, while the second land electrode is positioned to connect to the second external electrode on the opposite face through wiring circuits. This two-dimensional arrangement on the inspection circuit board enables simultaneous connection to external electrodes on opposite faces without requiring the semiconductor device to be reconfigured.
4Reliability
If additional external electrodes are provided on one face, then connection to opposite face is achieved, but high-density stacking effects are limited
Solution Approach 1:
The inspection connection functionality is extracted from the semiconductor integrated circuit itself and transferred to the inspection circuit board. Instead of modifying the semiconductor device by adding internal inspection electrodes, the inspection circuit board is designed with land electrodes and wiring circuits that externally connect to the existing external electrodes on opposite faces. This extraction approach maintains the original compact structure of the semiconductor device while enabling inspection capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient electrical connection of both external electrodes without increasing the semiconductor integrated circuit's size, maintaining high-density stacking effects and achieving satisfactory high-frequency transmission characteristics.
Implementation Method 1
a compression spring 84, urging the two plungers 85 and 86 in a protruding direction
Implementation Method 2
the external electrode 88 and the land electrode 91 are electrically connected through the two plungers 85 and 86 and the cylinder body 83
Implementation Method 3
impedance matching is achieved through characteristic impedance matching between the wiring board and the inspection circuit board or measuring device
Data Source
AI summary
A first conductive contact connecting a first electrode of an inspection circuit board and one external electrode of a semiconductor integrated circuit is arranged in a fixed member. A second conductive contact connecting a second electrode of a wiring board and the other external electrode of the semiconductor integrated circuit is arranged in a movable member. A third conductive contact connecting one third electrode of the inspection circuit board and the other third electrode of the wiring board is arranged in the movable member. The other third electrode is connected to the second electrode. When the movable member moves to the contacting position, the second conductive contact makes contact with the other external electrode, and the third conductive contact makes contact with the one third electrode.