Semiconductor Inspection Probe Positioning for Inductance Reduction
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Solution Overview
Problem
The integrated testing apparatus for power semiconductor modules suffers from decreased inspection accuracy due to the influence of the intermediate electrode plate's inductance during dynamic and static characteristics tests.
Innovation Solution
An inspection device with separate dynamic and static characteristics test probes that physically contact the device under test without an intermediate electrode, allowing for positional control to switch between test states, thereby minimizing inductance effects and improving measurement accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If an intermediate electrode plate is used to connect both dynamic and static characteristics testers, then device complexity is reduced and ease of operation is improved, but measurement precision deteriorates due to inductance effects
Solution Approach 1:
The testing apparatus is segmented into separate dynamic characteristics testing unit and static characteristics testing unit, each with its own dedicated probe. This segmentation eliminates the need for an intermediate electrode plate that causes inductance effects, thereby improving measurement precision for dynamic characteristics while maintaining device functionality through modular design.
Solution Approach 2:
The problematic intermediate electrode plate is extracted/removed from the system. Instead of using a shared electrode plate that introduces inductance, the invention directly connects the dynamic characteristics tester to the device under test through a dedicated probe, eliminating the source of measurement error while preserving the ability to perform both types of tests.
2Measurement precision
If separate probes for dynamic and static characteristics tests are used, then measurement precision is improved by reducing inductance, but device complexity increases
Solution Approach 1:
A single probe is designed to serve multiple functions: it can be positioned to contact different electrodes (emitter, collector, gate) of the device under test and is used for both dynamic characteristics testing and static characteristics testing. This multi-functionality reduces the total number of probes needed while maintaining separate testing capabilities, thereby reducing device complexity without sacrificing measurement precision.
Solution Approach 2:
The probe positioning system is made dynamic, allowing the probe to be moved between different test positions. This dynamic positioning capability enables a single probe to replace multiple fixed probes, reducing device complexity while maintaining the ability to perform both dynamic and static characteristics tests with high precision by eliminating inductance effects.
Data Source
AI summary
An inspection device comprises a stage for placing a device under test thereon, a dynamic characteristics test probe, a static characteristics test probe, and a control device configured to perform positional control by moving at least one of the stage, the dynamic characteristics test probe, and the static characteristics test probe. The control device performs the positional control such that the dynamic characteristics test probe is set to a dynamic characteristics test state in which the dynamic characteristics test probe is brought into contact with the electrode when the dynamic characteristics test is performed, and performs the positional control such that the static characteristics test probe is set to a static characteristics test state in which the static characteristics test probe is brought into contact with the electrode while the dynamic characteristics test probe is separated from the electrode when the static characteristics test is performed.