Semiconductor Module Inspection Robots and Temperature Control
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Solution Overview
Problem
Current semiconductor module inspection devices face inefficiencies in loading, unloading, and temperature-controlled testing processes, which can prolong testing times and increase equipment size, especially when handling semiconductor modules at varying temperatures.
Innovation Solution
A semiconductor module inspection device equipped with a receiver, loader, unloader, and multiple robots for transporting modules, along with temperature-controlled chambers and trays, allows for direct loading and unloading of modules and performs electrical tests at predetermined temperatures between 70° C and 130° C or −60° C and −20° C, optimizing the testing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor modules are transported using magazines or trays in groups, then the testing process can handle multiple modules simultaneously, but the equipment size and complexity increase
Solution Approach 1:
The system divides the batch processing function into individual module handling units (loaders and unloaders) that work in parallel with the temperature chamber, allowing multiple modules to be tested simultaneously without requiring complex magazine or tray mechanisms. Each loader/unloader pair handles individual modules independently.
2Reliability
If temperature-controlled chambers are used for testing semiconductor modules, then testing can be performed at various temperatures to evaluate reliability, but the testing time increases due to temperature stabilization
Solution Approach 1:
The loader is equipped with a temperature control unit that pre-heats or pre-cools semiconductor modules to the target test temperature before they enter the temperature chamber. This preliminary temperature adjustment eliminates the need for lengthy stabilization periods inside the chamber, as modules arrive already at the required temperature.
3Volume of stationary object
If direct loading and unloading of semiconductor modules is implemented, then the equipment size can be reduced, but the handling precision and reliability may be affected
Solution Approach 1:
The system introduces automated loaders and unloaders as intermediary devices between the external environment and the temperature chamber. These specialized handling units provide precise gripping, positioning, and transfer mechanisms that ensure reliable module handling while maintaining a compact overall equipment footprint compared to traditional magazine-based systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution minimizes testing time and equipment size by enabling efficient direct loading and unloading of semiconductor modules and performing electrical tests at various temperatures, enhancing the reliability and performance evaluation of semiconductor modules.
Implementation Method 1
a temperature control unit configured to heat or cool the semiconductor module to a predetermined temperature
Implementation Method 2
a first chamber configured to maintain an internal temperature thereof at a predetermined temperature
Data Source
AI summary
A semiconductor module inspection device is provided. The semiconductor module inspection device includes a receiver to store semiconductor modules; a loader to receive a semiconductor module from the receiver; a testing unit to receive the semiconductor module from the loader and perform a test process on the semiconductor module; an unloader to receive the semiconductor module from the testing unit and provide the semiconductor module from the testing unit to the receiver; and robots for transporting the semiconductor module. The robots include: a first robot to transport the semiconductor module from the receiver to the loader, a second robot to transport the semiconductor module from the loader to the testing unit, a third robot to transport the semiconductor module from the testing unit to the unloader, and a fourth robot to transport the semiconductor module from the unloader to the receiver.