Semiconductor Defect Inspection Using Ultrasonic Segmentation

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Solution Overview

Problem

The current ultrasonic inspection methods for semiconductors are time-consuming and inefficient, leading to delays in vehicle shipments and significant costs due to the lengthy verification of reliability, which often results in only a small percentage of semiconductors being found defective.

Innovation Solution

A method and apparatus for inspecting defects in semiconductors that involves analyzing the cross-section of the semiconductor before reliability verification, using ultrasonic inspections and pretreatment tests to identify delamination on lead portions, and employing ion milling equipment for detailed cross-sectional inspections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If reliability verification is performed on all semiconductors, then defect detection accuracy is improved, but inspection time and cost increase significantly

Engineering Contradiction:

Improvedefect detection accuracyVSAvoidinspection time

Core Design Contradiction:

Measurement precisionVSLoss of time

Solution Approach 1:

The inspection process is segmented into multiple stages: initial ultrasonic inspection, pretreatment, second ultrasonic inspection, cross-sectional inspection, and reliability verification. This segmentation allows systematic evaluation at different levels, focusing resources only on samples that require full verification, thereby reducing overall inspection time while maintaining accuracy.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Preliminary actions include performing initial ultrasonic inspection and pretreatment before the full reliability verification. These preliminary steps identify potential defects early, allowing only problematic samples to proceed to the time-consuming reliability verification stage, thus reducing total inspection time without compromising detection accuracy.

Inventive Principle:

Principle #10Preliminary action

2Measurement precision

If reliability verification is performed on all semiconductors, then defect detection accuracy is improved, but production cost increases

Engineering Contradiction:

Improvedefect detection accuracyVSAvoidproduction cost

Core Design Contradiction:

Measurement precisionVSLoss of energy

Solution Approach 1:

The inspection process is divided into stages where only a subset of semiconductors undergo full reliability verification. This segmentation reduces the total number of expensive verification tests while maintaining effective defect detection through preliminary screening methods.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Instead of performing complete reliability verification on all semiconductors, the method applies partial verification only to those showing signs of delamination through preliminary inspections. This partial action approach reduces overall cost while maintaining sufficient detection accuracy for identifying defective samples.

Inventive Principle:

Principle #16Partial or excessive action

3Productivity

If cross-sectional inspection is performed before reliability verification, then inspection efficiency is improved, but device complexity increases

Engineering Contradiction:

Improveinspection efficiencyVSAvoidinspection process complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The inspection process is segmented into distinct functional modules: exterior inspection, function inspection, first ultrasonic inspection, pretreatment, second ultrasonic inspection, cross-sectional inspection, and reliability verification. This modular segmentation improves efficiency by allowing parallel processing and clear workflow management, while the complexity is managed through standardized protocol implementation.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach dramatically shortens the time required to inspect defects in semiconductors by focusing reliability verification only on semiconductors with delamination, thereby reducing costs and minimizing delays in vehicle production.

Implementation Method 1

performing a first ultrasonic inspection on the semiconductor, performing a second ultrasonic inspection on the semiconductor

Methodology Applied

Scientific EffectUltrasonic wave propagation and reflection: Ultrasound

Implementation Method 2

the inspection of the cross-section of the lead portion may be carried out through an ion milling equipment

Methodology Applied

Scientific EffectIon milling: Ion Beam

Data Source

PatentUS20250093303A1Semiconductor defect inspection method and apparatus

Publication Date: 2025.03.20 HYUNDAI MOTOR CO LTD

AI summary

A method and an apparatus for inspecting defects in semiconductors may be incorporated in a vehicle production process. The apparatus includes an exterior inspection unit for inspecting an exterior of a semiconductor, a function inspection unit for inspecting functions of the semiconductor, a first ultrasonic inspection unit for performing a first ultrasonic inspection on the semiconductor, a pretreatment tester for performing a pretreatment on the semiconductor when the first ultrasonic inspection has been completed, a second ultrasonic inspection unit for performing a second ultrasonic inspection on the semiconductor when the pretreatment has been completed, and a cross-sectional inspection unit for inspecting a cross-section of the semiconductor when the second ultrasonic inspection shows that delamination has increased after the pretreatment.