Semiconductor Insulated Extension for BEOL Yield
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Solution Overview
Problem
As semiconductor devices scale down, the increased density of conductive structures leads to higher probabilities of short circuits and cross talk during back-end-of-line (BEOL) processing, resulting in decreased yield due to conductive extensions formed during processing.
Innovation Solution
Implementing an insulation process that transforms conductive extensions into insulated extensions by exposing them to an oxidizing or nitriding gas or plasma, reducing their conductivity and increasing resistivity, thereby minimizing undesirable conductive reach and preventing short circuits or cross talk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If device density increases and geometry sizes decrease, then production efficiency increases and costs decrease, but short circuits and cross talk occur during BEOL processing, resulting in decreased yield
Solution Approach 1:
The patent applies preliminary action by performing an insulation process on conductive extensions before they can cause short circuits or cross talk during subsequent BEOL processing. The insulation process transforms conductive extensions into insulated extensions, preventing future harmful electrical coupling between conductive structures.
Solution Approach 2:
The patent converts the harmful conductive extensions (which cause short circuits and cross talk) into beneficial insulated extensions through oxidation or nitriding. The harmful conductive material is transformed into a beneficial insulating layer that prevents electrical coupling and improves yield.
2Ease of manufacture
If conventional fabrication techniques are used, then manufacturing simplicity is maintained, but conductive extensions cause short circuits and cross talk, reducing yield
Solution Approach 1:
The patent changes the electrical parameter of the conductive extensions by exposing them to oxidizing or nitriding gases, transforming them from conductive to insulating state. This parameter change eliminates the harmful electrical coupling while maintaining manufacturing simplicity through integration into existing BEOL processes.
3Quantity of substance
If device scale decreases, then functional density increases, but conductive extensions formed during processing cause more frequent short circuits and cross talk
Solution Approach 1:
The patent extracts the harmful conductive property from the extensions by transforming them into insulating structures through oxidation or nitriding. This removes the harmful factor of electrical coupling while preserving the physical presence of the extensions for structural support.
Solution Approach 2:
The patent introduces oxidizing or nitriding gases as intermediaries that transform the conductive extensions into insulated extensions. These intermediary substances enable the transformation without requiring direct contact or complex processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The insulation process effectively reduces the conductivity of conductive extensions, enhancing the non-conductive separation between structures and increasing yield rates by preventing undesirable electrical coupling, thus improving the reliability of BEOL processing.
Implementation Method 1
exposing them to an oxidizing or nitriding gas or plasma
Implementation Method 2
exposing them to an oxidizing or nitriding gas or plasma
Data Source
AI summary
A semiconductor device includes: a plurality of vertical conductive structures, wherein each of the plurality of vertical conductive structures extends through an isolation layer; and an insulated extension disposed horizontally between a first one and a second one of the plurality of vertical conductive structures.