Semiconductor Device Insulating Plate Adhesion Gap

The patent applies different materials with different adhesion properties to different regions of the substrate. Specifically, an insulating plate material with high adhesion to mold material is used in regions where strong bonding is needed, while maintaining the conductive pattern functionality in other areas. This local differentiation of material properties resolves the contradiction by providing strong adhesion where required without compromising the electrical function.

The patent employs a composite structure consisting of multiple materials including insulating plate material, conductive materials, and mold material. The insulating plate material serves as an intermediate layer that provides both electrical insulation and strong adhesion to the mold material, creating a composite system that simultaneously satisfies electrical connection requirements and adhesion requirements.

The patent incorporates gaps in the conducting portion structure beforehand, before the mold material is applied. These pre-formed gaps allow the mold material to penetrate and create anchoring protrusions, providing strong peel resistance. By preparing the gap structure in advance during the conducting portion fabrication process, the patent avoids adding complex post-processing steps.

The mold material acts as an intermediary substance that fills the gaps between the conducting portion and insulating plate. This intermediate material creates mechanical interlocking through anchoring protrusions, effectively bonding the conducting portion to the insulating plate without requiring direct contact or additional bonding layers between these components.