Semiconductor Insulating Layer Alpha Ray Blocking

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Solution Overview

Problem

Conventional semiconductor devices and manufacturing methods experience soft errors due to alpha rays generated from materials like Pb, Sn, and inorganic fillers, which can rewrite information stored in memory cells.

Innovation Solution

A semiconductor device with an insulating layer containing alpha ray blocking materials such as polyimide and/or polyimide-based compounds, and an inorganic filler amount adjusted to minimize alpha ray detection, combined with a Pb-free external connection terminal and filler-less solder resist, to reduce soft errors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional materials (Pb, Sn, inorganic fillers) are used in insulating layers and external connection terminals, then manufacturing ease and cost are improved, but soft errors occur due to alpha ray generation

Engineering Contradiction:
Improveease of manufactureVSAvoiddata integrity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the material composition parameters of the insulating layer by incorporating alpha ray blocking materials such as polyimide and specific inorganic fillers (BaSO4, Pb-free glass beads) with controlled particle sizes and concentrations. This parameter change blocks alpha rays while maintaining manufacturing feasibility through established coating and curing processes.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite insulating layer material combining epoxy resin or cyanate ester resin base with alpha ray blocking materials (polyimide at 1-20 wt%, inorganic fillers). This composite structure provides both the adhesive and insulating properties of the base resin and the alpha ray blocking capability of the added materials, achieving data integrity without sacrificing ease of manufacture.

Inventive Principle:
Principle #40Composite materials

2Strength

If inorganic fillers are added to insulating layer, then mechanical strength and thermal expansion control are improved, but alpha ray generation increases causing soft errors

Engineering Contradiction:
Improvemechanical strengthVSAvoidalpha ray generation
Core Design Contradiction:
StrengthVSObject-generated harmful factors

Solution Approach 1:

The patent replaces traditional long-term stable inorganic fillers like PbO and BaO that generate alpha rays with shorter-lived or stable isotopes such as Pb-free glass beads and BaSO4 that do not generate harmful radiation. This substitution maintains the mechanical strength and thermal expansion control functions while eliminating alpha ray generation.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent changes the particle size parameter of inorganic fillers to 1-10 μm range and controls their concentration at 1-50 wt% in the insulating layer. These parameter changes optimize both the mechanical reinforcement effect and the alpha ray blocking capability, achieving strength improvement without increasing harmful radiation.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively blocks alpha rays and reduces soft errors, enhancing data integrity by minimizing alpha ray-induced errors in semiconductor devices.

Implementation Method 1

the insulating layer is constructed to contain an alpha ray blocking material including polyimide and/or a polyimide-based compound

Methodology Applied
Scientific EffectAlpha ray blocking: Absorption (EM radiation)

Data Source

PatentUS8193617B2Semiconductor device and manufacturing method therefor
Publication Date: 2012.06.05 SHINKO ELECTRIC IND CO LTD
  • US8193617B2 patent drawing
  • US8193617B2 patent drawing
  • US8193617B2 patent drawing

AI summary

There is provided a semiconductor device including a semiconductor substrate on which a plurality of semiconductor chips having electrode pads is formed, an internal connection terminal provided on each of the electrode pads, an insulating layer provided to cover the plurality of semiconductor chips and the internal connection terminals, and a wiring pattern connected to the internal connection terminals across the insulating layer. This semiconductor device is characterized in that the insulating layer is configured to contain an alpha ray blocking material including polyimide and/or a polyimide-based compound.