Semiconductor Device Insulating Block Bonding Stability
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Solution Overview
Problem
Conventional semiconductor devices face challenges in stabilizing the bonding between electrode terminals and internal wiring due to insufficient heat transfer, leading to unreliable connections and deformation of the substrate during temperature changes.
Innovation Solution
A semiconductor device configuration that includes a base part with an insulating block between the semiconductor element and the case, where the internal wiring is bonded to the electrode terminal on the insulating block, allowing efficient heat transfer and stabilization of the bonding area through the use of a solder material, ensuring reliable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heating means is used to increase temperature for solder bonding, then bonding temperature is sufficient, but substrate deforms due to temperature change
Solution Approach 1:
A support structure is introduced as an intermediary component between the substrate and the electrode terminal. This support structure bears the load of the electrode terminal and internal wiring, preventing substrate deformation during heating. The substrate serves only as a mounting base for the semiconductor element, while the support structure handles the mechanical stresses, allowing sufficient bonding temperature to be achieved without substrate deformation.
2Ease of operation
If electrode terminal protrudes from case for bonding access, then bonding area is accessible, but temperature is insufficiently increased at bonding location
Solution Approach 1:
The support structure acts as a thermal intermediary that conducts heat from the heating means to the bonding area between the electrode terminal and internal wiring. By providing this dedicated heat conduction path, the bonding location receives sufficient temperature even though the electrode terminal protrudes from the case for accessibility.
3Device complexity
If substrate serves as both mounting base and heat conduction path, then structure is simplified, but bonding temperature is insufficient and substrate deforms
Solution Approach 1:
The device structure is segmented into distinct functional components: the substrate serves only as a mounting base for the semiconductor element, while a separate support structure handles both the mechanical support of the electrode terminal and the heat conduction to the bonding area. This segmentation allows each component to perform its specific function optimally, achieving reliable bonding without substrate deformation.
Solution Approach 2:
The support structure is introduced as an intermediary component that专门 handles the heat conduction and mechanical support functions. This intermediary structure resolves the conflict between simplified substrate design and reliable bonding by providing a dedicated path for heat and force transmission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the stability and reliability of the bond between the electrode terminal and internal wiring, maintaining a favorable solder bonding even under temperature fluctuations, thus improving the overall performance and durability of the semiconductor device.
Implementation Method 1
a first plate-like connection wiring which is not integrated with a case is connected to an external connection terminal and a semiconductor element via a solder material
Implementation Method 2
a first plate-like connection wiring which is not integrated with a case is connected to an external connection terminal and a semiconductor element via a solder material
Data Source
AI summary
Provided is a semiconductor device stabilizing bond properties between an electrode terminal provided on a case and an internal wiring connected to a semiconductor element. A semiconductor device includes a base part, a semiconductor element, an electrode terminal, an insulating block, and an internal wiring. The semiconductor element is mounted on the base part. The electrode terminal is held by a case surrounding an outer periphery of the semiconductor element. An end portion of the electrode terminal protrudes toward an inner side of the case. The insulating block is provided on the base part between the semiconductor element and the case. In the internal wiring, one end portion is bonded to the end portion of the electrode terminal on the insulating block, and part of a region extending from the one end portion to the other end portion is bonded to the semiconductor element.