Semiconductor Device Insulating Resin Layer Deformation Control
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Solution Overview
Problem
Conventional semiconductor device manufacturing methods face challenges in achieving reliable heat dissipation and insulation due to deformation of insulating resin sheets during curing, which can lead to defects and reduced reliability, especially at the outer peripheral edges where electric fields are concentrated.
Innovation Solution
The semiconductor device incorporates a heatsink with an insulating resin layer and two types of mold resins: a high thermal conductivity first mold resin that extends to the outer edge of the insulating resin layer and a second mold resin with different properties, ensuring uniform curing pressure and increased contact area to prevent deformation and enhance insulation reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If heating and pressing are performed to cure the sealing resin in a state in which the frame having the die pad is arranged on the resin sheet, then the resin sheet and the frame can be firmly fixed to each other, but the resin sheet may deform due to pushing by the frame, causing bulges and voids that reduce insulation reliability
Solution Approach 1:
The resin sheet is pre-arranged on the heatsink before the frame is mounted, establishing a stable base layer that prevents deformation during subsequent curing processes. This preliminary positioning ensures the insulating resin layer maintains its flatness while still achieving firm fixation between components.
2Reliability
If the resin sheet is used to provide insulation between the frame and heatsink, then insulation characteristics are improved, but the resin sheet may deform at the outer peripheral edge where electric field is concentrated, reducing reliability
Solution Approach 1:
The insulating resin layer is applied specifically at the outer peripheral edge of the heatsink where electric fields are concentrated, providing enhanced local insulation where it is most needed. This localized approach maintains structural integrity while improving insulation reliability in the critical high-stress region.
3Ease of manufacture
If a single type of mold resin is used to cover the metallic plate and semiconductor chip, then the manufacturing process is simplified, but uniform curing pressure cannot be achieved, leading to potential deformation
Solution Approach 1:
The mold resin is divided into two distinct types: a first mold resin with high thermal conductivity used for the sealing portion requiring uniform heat distribution, and a second mold resin with different properties used for other portions. This segmentation allows each resin type to be optimized for its specific function, achieving uniform curing pressure while maintaining manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the reliability of the semiconductor device by preventing resin deformation and reducing the risk of insulation breakdown, thereby enhancing the device's operational stability and performance.
Implementation Method 1
the first mold resin includes a third surface located in the same plane as that of the first surface of the metallic plate... the first mold resin having a high thermal conductivity
Implementation Method 2
an insulating resin layer... being formed on the heatsink... the resin sheet and the frame can be successfully firmly fixed to each other, and a semiconductor device having high heat dissipation characteristics
Data Source
AI summary
A semiconductor device includes a heatsink, an insulating resin layer on the heatsink, and a metallic plate including a first surface in contact with a first region of the insulating resin layer and a second surface to which a semiconductor chip is adhered. The device further includes a lead terminal connected to the metallic plate; a first mold resin covering a part of the metallic plate and a part of the lead terminal; and a second mold resin covering another part of the metallic plate, the semiconductor chip, and another part of the lead terminal. The first mold resin has a third surface in the same plane as that of the first surface, the third surface extending from an outer peripheral edge of the metallic plate to that of the insulating resin layer or outside thereof in plan view in contact with the second region of the insulating resin layer.