Semiconductor Insulation Layer Cost Reduction via Non-Photosensitive Material
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Solution Overview
Problem
Conventional semiconductor devices with chip scale package (CSP) structures have high manufacturing costs due to the use of costly, photosensitive materials for both insulation layers, which complicates the process and increases expenses.
Innovation Solution
The semiconductor device employs a first insulation layer made of photosensitive material and a second insulation layer made of a cheaper, non-photosensitive material, such as epoxy molding compound or insulative dry film, which simplifies the manufacturing process and reduces costs by eliminating the need for photolithography in forming the second insulation layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photosensitive material is used for both insulation layers, then manufacturing precision and pattern formation are improved, but manufacturing cost increases
Solution Approach 1:
The patent divides the insulation structure into two distinct layers: a first insulation layer made of photosensitive material that requires precise patterning, and a second insulation layer made of non-photosensitive material that does not require photolithography. This segmentation allows each layer to be optimized for its specific function, reducing overall manufacturing cost while maintaining necessary precision where required.
Solution Approach 2:
The patent applies different material properties to different locations in the structure. The first insulation layer uses photosensitive material only where precise pattern formation is needed (near bond pads and redistribution layers), while the second insulation layer uses cheaper non-photosensitive material in areas where simple coverage and protection are sufficient, thus optimizing cost versus precision locally.
2Reliability
If photosensitive material is used for the second insulation layer, then electrical connectivity and protection are improved, but device complexity increases
Solution Approach 1:
The patent extracts the photolithography process requirement from the second insulation layer formation, eliminating the need for photoresist coating, exposure, and development steps for this layer. This reduces manufacturing process complexity while the first insulation layer retains photosensitive material where precise electrical connectivity patterns are required.
Solution Approach 2:
Instead of using the same expensive photosensitive material for both insulation layers, the patent inverts the approach by using non-photosensitive material for the second layer where simple coverage is sufficient, and reserves photosensitive material only for the first layer where precise patterning is essential for electrical connectivity.
Data Source
AI summary
A semiconductor device and a manufacturing method thereof are disclosed. A first insulation layer is formed on a semiconductor die, a redistribution layer electrically connected to a bond pad is formed on the first insulation layer, and a second insulation layer covers the redistribution layer. The second insulation layer is made of a cheap, non-photosensitive material. Accordingly, the manufacturing cost of the semiconductor device can be reduced.