Semiconductor Insulation Structure Deformation Control
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Solution Overview
Problem
In semiconductor insulation structures, the deformation mismatch between radiator plates and coolers leads to stress concentration and potential damage to insulation members, compromising the electrically insulating property between semiconductor modules and conductive structural bodies.
Innovation Solution
A semiconductor insulation structure design where one abutment surface is made of a deformation-resistant material with a lower deformation rate and the other of a readily deforming material with a higher deformation rate, with the deformation-resistant surface positioned outside the readily deforming surface's outer circumferential periphery to prevent stress concentration and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If coolers with high deformation rate are pressurized against radiator plates with low deformation rate, then cooling contact is improved, but stress concentration occurs causing insulation member damage
Solution Approach 1:
The patent applies local quality by creating a soft layer (deformation-resistant material layer) at the specific location where the cooler contacts the radiator plate. This localized soft layer absorbs deformation stress at the contact interface, preventing stress concentration from damaging the insulation member while maintaining good thermal contact between the aluminum cooler and copper radiator plate.
2Ease of manufacture
If coolers are made of aluminum with high deformation rate, then ease of manufacture and cost are improved, but deformation mismatch with copper radiator plates causes stress concentration
Solution Approach 1:
The patent applies composite materials by combining aluminum cooler with a soft layer (deformation-resistant material layer) made of materials such as copper, brass, or stainless steel. This composite structure allows the cooler to maintain its manufacturing advantages while the soft layer provides deformation compatibility with the copper radiator plate, preventing stress concentration and insulation member damage.
3Strength
If deformation-resistant material layer is added to cooler, then stress concentration is prevented, but device complexity increases
Solution Approach 1:
The patent applies flexible shells and thin films by using a thin soft layer (deformation-resistant material layer) on the cooler surface. This thin layer is sufficient to provide stress distribution and prevent insulation member damage, while minimizing the increase in device complexity and maintaining the overall compact structure of the semiconductor module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents damage to insulation members, maintaining reliable electrically insulating properties while enhancing cooling efficiency and operating life of semiconductor elements.
Implementation Method 1
One of the first and second abutment surfaces is made of material to provide a deformation resistant abutment surface with a less deformation rate in terms of a given load and the other one of the first and second abutment surfaces is made of material to provide a readily deforming abutment surface with a greater deformation rate in terms of the given load
Data Source
AI summary
A semiconductor insulation structure is disclosed for a semiconductor module, incorporating therein a semiconductor element, with which an electrically conductive structural body is held in pressured contact via an intervening insulation member. The semiconductor insulation structure includes a deformation preventing structure to avoid the insulation member from deforming when applied with load thereto. In one aspect, the deformation preventing structure includes a deformation resistant abutment surface, formed on the semiconductor module, and a readily deforming abutment surface formed on the electrically conductive structural body. In another aspect, the deformation preventing structure includes a reinforcement formed on a cooler and held in contact with the insulation member in an area placed in opposition to an outer circumferential periphery of the semiconductor module.