Semiconductor Device Insulation via Heat Sink Thickness Gap
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Solution Overview
Problem
Conventional power semiconductor devices face challenges in achieving sufficient electrical insulation between the screw and heat dissipation plate while maintaining a compact size and low cost, as existing solutions like insulating sheets increase costs.
Innovation Solution
The semiconductor device incorporates a heat dissipation plate with a thickness lack portion facing the screw, allowing for increased distance between the screw and heat dissipation plate without additional insulation members, thereby reducing thickness and cost while maintaining sufficient insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating sheet is disposed on the heat dissipation plate to achieve sufficient insulation properties between the screw and the heat dissipation plate, then insulation properties are improved, but manufacturing cost increases
Solution Approach 1:
The patent extracts the insulating function from a separate insulating sheet component and integrates it directly into the heat dissipation plate by forming an insulating layer on its surface. This eliminates the need for a separate insulating sheet while maintaining insulation properties, thereby reducing part count and manufacturing cost.
Solution Approach 2:
The patent merges the heat dissipation function and the insulation function into a single component (the heat dissipation plate with integrated insulating layer). By combining these two functions that were previously performed by separate components, the patent reduces overall device complexity and manufacturing cost while maintaining reliable insulation.
2Length of stationary object
If the heat dissipation plate is positioned close to the screw to reduce device thickness, then device size is reduced, but insulation properties deteriorate
Solution Approach 1:
The patent applies local quality by creating a localized insulating layer only on the specific region of the heat dissipation plate that contacts or approaches the screw. This localized treatment provides sufficient insulation where needed while allowing the overall device thickness to remain compact, as insulation is not required throughout the entire heat dissipation plate.
Solution Approach 2:
The insulating layer acts as an intermediary substance between the heat dissipation plate and the screw. This thin intermediate layer provides the necessary electrical insulation while occupying minimal space, thereby maintaining compact device thickness without compromising insulation properties.
3Reliability
If additional insulating components are added to ensure insulation between screw and heat dissipation plate, then insulation properties are improved, but device complexity increases
Solution Approach 1:
The patent merges the insulation function with the heat dissipation plate, transforming what would be a separate insulating component into an integrated feature of the heat dissipation plate itself. This reduces the total number of components and simplifies device assembly while ensuring reliable insulation.
Solution Approach 2:
The heat dissipation plate serves its own insulation need by having an insulating layer formed on its surface. This self-service approach eliminates the need for separate insulating components, as the heat dissipation plate itself provides both thermal management and electrical insulation functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a smaller and less costly power semiconductor device with adequate insulation properties between the screw and heat dissipation plate, enhancing thermal dissipation and preventing deformation due to temperature changes.
Implementation Method 1
a heat dissipation plate made of metal to dissipate heat generated within the housing to the outside
Data Source
AI summary
It is an object of the present invention to provide a semiconductor device that has sufficient insulation properties between a screw and a heat dissipation plate, and is smaller and less costly. A semiconductor device of the present invention includes the following: a housing containing a semiconductor element; a heat dissipation plate disposed on a bottom surface of the housing, and provided to partly extend beyond the housing to reach the outside; an electrode electrically connected to the semiconductor element, and provided to partly protrude from the housing to the outside in parallel with the heat dissipation plate; and a screw with which an exposed portion of the electrode, protruding from the housing is joined to a busbar. The heat dissipation plate has a thickness lack portion in a location of the heat dissipation plate, the location at least facing the screw, the location being on a screw side.