Semiconductor Package Insulation Layout for Heat Dissipation

Solution Overview

Problem

Semiconductor devices face challenges in balancing thermal resistance and insulating properties, particularly in efficiently dissipating heat while maintaining reliability and preventing reliability deterioration due to the thickness and distribution of insulating layers.

Innovation Solution

A semiconductor device design featuring a heat dissipation base with a thinner insulating layer in the placement area for the semiconductor chip, where the first thickness is less than the second thickness outside this area, combined with protruding conductive and heat dissipation parts to enhance heat transfer and maintain insulating properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the insulating layer thickness is increased to maintain insulating properties, then reliability is improved, but heat dissipation performance deteriorates

Engineering Contradiction:

Improveinsulating propertiesVSAvoidheat dissipation performance

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The insulating layer is designed with different thicknesses in different regions: a first thickness in the placement area and a second thickness outside the placement area. This local differentiation allows the placement area to have sufficient insulation for reliability while the outer areas can be thinner to facilitate heat dissipation from the semiconductor chip.

Inventive Principle:

Principle #3Local quality

2Temperature

If the insulating layer thickness is decreased to improve heat dissipation, then heat dissipation performance is improved, but insulating properties deteriorate

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidinsulating properties

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The insulating layer is designed with different thicknesses in different regions: a first thickness in the placement area and a second thickness outside the placement area. This local differentiation allows the placement area to have sufficient insulation for reliability while the outer areas can be thinner to facilitate heat dissipation from the semiconductor chip.

Inventive Principle:

Principle #3Local quality

3Reliability

If the insulating layer thickness is uniformly increased, then insulating properties are improved, but device complexity increases

Engineering Contradiction:

Improveinsulating propertiesVSAvoidinsulating layer structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The insulating layer is designed with different thicknesses in different regions: a first thickness in the placement area and a second thickness outside the placement area. This local differentiation allows the placement area to have sufficient insulation for reliability while the outer areas can be thinner to facilitate heat dissipation from the semiconductor chip.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively transfers heat from the semiconductor chip while maintaining the insulating properties of the device, thereby preventing reliability deterioration and improving heat dissipation.

Implementation Method 1

a first thickness of the insulating layer in the placement area is less than a second thickness of a part of the insulating layer that is located outside the placement area

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS20240387314A1Semiconductor device

Publication Date: 2024.11.21 FUJI ELECTRIC CO LTD

AI summary

A semiconductor device includes a circuit board including: a heat dissipation base having a top surface; an insulating layer having a front surface, and a rear surface which is opposite to the front surface and which is disposed on the top surface of the heat dissipation base, the insulating layer having a placement area set therefor; and a conductive circuit layer having a rear surface which is disposed in the placement area of the insulating layer. A first thickness of the insulating layer in the placement area is less than a second thickness of the insulating layer in an outside area outside the placement area.