Semiconductor Package Insulation Layer Pattern Process Reduction
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Solution Overview
Problem
The manufacturing process for wafer level semiconductor packages is complex due to the need for multiple processes to form insulation layers with openings for redistribution line patterns, increasing the number of steps required.
Innovation Solution
A semiconductor package design that reduces the number of processes by using a method involving two insulation layer patterns with specific open areas, allowing for the exposure of redistribution line patterns without the need for a photo process, and using a scraper or spraying method for applying insulation material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a coating process, lithographic process, and development process are implemented to form insulation layers with openings, then the insulation layer can be formed with precise patterns, but the number of manufacturing processes markedly increases
Solution Approach 1:
The patent combines the coating process and the lithographic-development process into a single integrated process. The photoresist material is applied and patterned in one continuous operation, eliminating the need for separate coating, exposure, and development steps. This merging reduces the total number of processes while maintaining the precision of the insulation layer pattern formation.
Solution Approach 2:
The patent employs a single process that performs multiple functions: it applies the photoresist material, forms the insulation layer pattern, and creates the openings simultaneously. This multi-functional approach replaces the traditional multi-step process sequence, reducing manufacturing complexity while achieving the same precision outcomes.
2Manufacturing precision
If multiple separate processes are used to form insulation layers, then each process can be optimized independently, but the overall manufacturing time and complexity increase
Solution Approach 1:
By merging the coating and lithographic-development processes into a single integrated process, the patent eliminates the time required for transitions between separate processes. The insulation layer is formed with precise patterns in one continuous operation, reducing total manufacturing time while maintaining quality through the unified process design.
Solution Approach 2:
The integrated process ensures continuous useful action throughout the insulation layer formation. The photoresist material is applied and patterned without interruption or intermediate steps, maintaining continuous productive activity. This continuity eliminates idle time between processes while the single process is designed to achieve the same precision as multiple optimized processes would provide.
Data Source
AI summary
A semiconductor package and a method for manufacturing the same. The semiconductor package includes a semiconductor chip having bonding pads; a first insulation layer pattern; redistribution line patterns; a second insulation layer pattern; and conductive balls. The first insulation layer pattern having first openings exposing the bonding pads. The redistribution line patterns are located on the first insulation layer pattern and are electrically connected with the bonding pads. The second insulation layer pattern covering the redistribution line patterns and having second openings having first open areas which expose portions of the redistribution line patterns and having second open areas which extend from the first open areas along the semiconductor chip. The conductive balls are electrically connected with the portions of the redistribution line patterns which are exposed through the first open areas of the second insulation layer pattern.