Semiconductor Device Insulation Sheet Thermal Dissipation
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Solution Overview
Problem
Semiconductor devices, such as intelligent power modules, face challenges in achieving both high heat dissipation and insulation while maintaining cost-effectiveness, as existing methods rely on insulation sheets with high thermal conductivity, which increase costs due to their extensive use.
Innovation Solution
A semiconductor device design featuring a lead frame with a die pad having distinct mounting and back regions, where the first back region is covered with an insulation sheet of higher thermal conductivity than the mold resin, and the second back region is exposed to the mold resin without an insulation sheet, allowing for efficient heat dissipation and insulation while minimizing the number of insulation sheets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an insulation sheet with high thermal conductivity is disposed on both back regions of the die pad, then heat dissipation performance is improved, but device cost increases due to increased material usage
Solution Approach 1:
The patent applies local quality by differentiating the treatment of the two back regions: the first back region (opposite the first mounting region) is equipped with an insulation sheet having high thermal conductivity for effective heat dissipation, while the second back region (opposite the second mounting region) is left without an insulation sheet. This selective approach optimizes heat dissipation where most needed while reducing material costs, thereby resolving the contradiction between heat dissipation performance and device cost.
2Reliability
If an insulation sheet is disposed on the back surface of the die pad, then insulation performance is improved, but device cost increases due to additional materials
Solution Approach 1:
The patent implements local quality by selectively placing the insulation sheet only on the first back region rather than the entire back surface. This localized insulation approach provides sufficient insulation performance for the high-power first semiconductor element while minimizing material usage and cost, effectively resolving the contradiction between insulation performance and device cost.
3Ease of manufacture
If the mold resin is formed by transfer molding, then manufacturing process is simplified, but resin charging completeness deteriorates due to unfilled portions and voids
Solution Approach 1:
The patent applies preliminary action by pre-forming protrusions on the mounting surfaces of the die pad before the transfer molding process. These protrusions serve as nucleation points that guide resin flow and prevent the formation of unfilled portions and voids during molding, thereby ensuring complete resin charging while maintaining the simplicity of the transfer molding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables effective heat dissipation and insulation, reducing the area and cost of insulation sheets, thereby lowering the overall cost of the semiconductor device while maintaining high thermal performance.
Implementation Method 1
the insulation sheet having a thermal conductivity higher than a thermal conductivity of the mold resin. Heat generated by the first semiconductor element is satisfactorily dissipated, through the insulation sheet having a thermal conductivity higher than a thermal conductivity of the mold resin, to the outside of the mold resin.
Data Source
AI summary
In a semiconductor device, lead frame includes a die pad. The die pad includes a mounting surface and a back surface. The mounting surface includes first and second mounting regions. The back surface includes first and second back regions. The first and second semiconductor elements are mounted on the first and second mounting regions, respectively. The first and second back regions are located on opposite sides from the first and second mounting regions, respectively. The mold resin has the first semiconductor element, the second semiconductor element, and the die pad encapsulated therein and is in direct contact with the second back region. The insulation sheet is disposed on the first back region to be exposed outside the mold resin, the insulation sheet having a thermal conductivity higher than a thermal conductivity of the mold resin.