Semiconductor Device Integrated Control Circuit Lead Frame

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Solution Overview

Problem

The manufacturing process of semiconductor devices with integrated converter, brake, and inverter circuits is complicated due to the use of lead frames and control circuit boards, which requires handling and assembly of both components.

Innovation Solution

A semiconductor device design that uses die pads and leads with wire bonding for circuit elements, encapsulated in a resin body, eliminating the need for a control circuit board and simplifying the assembly process by connecting leads via wires and using a single-plate lead frame for manufacturing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a lead frame and control circuit board are used in combination, then the semiconductor device can be manufactured with integrated control circuits, but the manufacturing process becomes complicated due to the need to handle and assemble both components

Engineering Contradiction:

Improveintegrated control circuit capabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges the control circuit board function directly into the lead frame structure by forming control circuit patterns on the lead frame itself. This integration eliminates the need for separate control circuit boards and their associated assembly processes, thereby reducing manufacturing complexity while maintaining the capability for integrated control circuits.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The lead frame is designed to serve multiple functions: it acts as both the structural support framework and the control circuit substrate. By making the lead frame multi-functional, the patent eliminates the need for separate dedicated control circuit boards, simplifying the overall manufacturing process while preserving integrated control capabilities.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If a lead frame and control circuit board are used in combination, then integrated control circuits can be mounted, but the assembly process requires handling both components separately

Engineering Contradiction:

Improveintegrated control circuit mountingVSAvoidassembly process simplicity

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The control circuit patterns are directly formed on the lead frame structure, merging what were previously separate components (lead frame and control circuit board) into a single integrated component. This eliminates the need for separate handling and assembly of control circuit boards, significantly improving ease of manufacture.

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If separate control circuit boards are used, then control circuits can be integrated, but the package size increases and costs increase

Engineering Contradiction:

Improvecontrol circuit integrationVSAvoidpackage area

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

By merging the control circuit functionality directly into the lead frame structure through pattern formation, the patent eliminates the need for separate control circuit boards. This integration significantly reduces the overall package area while maintaining the capability for control circuit integration.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The lead frame is designed to perform multiple functions simultaneously: structural support, electrical connection, and control circuit substrate. This multi-functionality allows control circuits to be integrated without requiring additional space for separate control circuit boards, thereby reducing package area.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Adaptability or versatility

If separate control circuit boards are used, then control circuits can be integrated, but manufacturing costs increase

Engineering Contradiction:

Improvecontrol circuit integrationVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The control circuit patterns are formed directly on the lead frame during the lead frame manufacturing process, merging what were previously separate manufacturing processes. This integration eliminates the need for separate control circuit board fabrication and assembly operations, thereby reducing manufacturing costs while maintaining control circuit integration capability.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS9324685B2Semiconductor device and method of manufacturing the same

Publication Date: 2016.04.26 MITSUBISHI ELECTRIC CORP

AI summary

There is provided a semiconductor device having a converter circuit, a brake circuit and an inverter circuit and manufacturable by a simplified manufacturing process. The semiconductor device has a plurality of die pads, IGBTs, diodes, freewheel diodes, an HVIC and LVICs mounted on the plurality of die pads, a plurality of leads, and an encapsulation resin body that covers these component parts. In a manufacturing process, a single-plate lead frame having the above-described plurality of die pads and leads connected together can be prepared. The semiconductor device may be manufactured by using this single-plate lead frame.