Semiconductor IC Card Integrating SIM and Storage

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Solution Overview

Problem

Current communication devices require separate SIM cards and storage devices, occupying multiple external card slots and limiting their ability to perform both subscriber authentication and data storage functions simultaneously.

Innovation Solution

A semiconductor IC card integrating a SIM circuit and a nonvolatile storage device within a single package, with distinct SIM and memory pins for electrical connection, allowing it to perform both subscriber authentication and data storage functions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If separate SIM cards and storage devices are used, then subscriber authentication and data storage functions are performed, but multiple external card slots are occupied

Engineering Contradiction:

Improvefunctional integrationVSAvoidnumber of card slots

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines the SIM card and storage device into a single integrated card unit. The SIM circuit and storage device are packaged together in one external package, allowing both subscriber authentication and data storage functions to be performed simultaneously through a single card slot, thereby reducing device complexity while maintaining functional versatility

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated card serves multiple functions: it acts as both a SIM card for subscriber authentication and a storage device for data storage. This multi-functional design allows the single card to replace what previously required two separate cards, improving adaptability without increasing the number of card slots needed

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Device complexity

If SIM circuit and storage device are integrated in single package, then fewer card slots are needed, but internal separation and pin assignment complexity increases

Engineering Contradiction:

Improvenumber of card slotsVSAvoidinternal package structure

Core Design Contradiction:

Device complexityVSEase of manufacture

Solution Approach 1:

The integrated card is divided into distinct functional modules: a SIM circuit portion and a storage device portion. These modules are physically separated within the external package with dedicated connection regions, allowing independent manufacturing and testing of each module while maintaining their integrated function in the final product

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent uses an insulating layer as an intermediary between the SIM circuit and storage device portions. This insulating layer with through-conductive-plugs serves as a mediator that enables electrical connection between the two separate modules while maintaining their physical separation, simplifying the manufacturing process by providing a standardized interface between components

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS11037042B2Semiconductor integrated circuit cards and communication systems including the same

Publication Date: 2021.06.15 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor integrated card includes an external package, a subscriber identification module (SIM) circuit, a plurality of SIM pins, a storage device and a plurality of memory pins. The SIM circuit is formed inside of the external package and is configured to store subscriber information. The SIM pins are formed on a surface of the external package and are electrically connected to the SIM circuit. The storage device is formed inside of the external package and is separated from the SIM circuit. The storage device includes a nonvolatile memory device. The memory pins are formed on the surface of the external package and are electrically connected to the storage device.