Semiconductor Device Inter-Line Protective Layer Void Prevention
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Solution Overview
Problem
Conventional semiconductor device manufacturing processes result in void formation between signal lines and photosensitive resin due to erosion during development, leading to potential damage from thermal expansion, moisture expansion, and ion migration, causing insulation failures.
Innovation Solution
A semiconductor device with a protective layer formed in inter-line regions between signal lines, where photosensitive resin is strategically placed to prevent void formation, and a manufacturing method involving exposure and development steps to ensure the protective layer covers these areas, preventing solvent infiltration and erosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If photolithography is used to form patterns with photosensitive resin, then the semiconductor element can be secured with the photosensitive resin, but the edges of the photosensitive resin are eroded by the solvent in the development process, forming spaces between signal lines and the photosensitive resin
Solution Approach 1:
The patent applies a protective layer to the substrate before forming the photosensitive resin pattern. This protective layer is formed in advance to prevent solvent erosion of the photosensitive resin edges during the development process, thereby maintaining edge integrity while still allowing the photosensitive resin to secure the semiconductor element
Solution Approach 2:
The protective layer acts as an intermediary between the solvent and the photosensitive resin. It prevents direct contact between the solvent and the photosensitive resin edges, thereby preventing erosion while allowing the development process to proceed normally
2Reliability
If photosensitive resin is left around the semiconductor element to secure it, then the semiconductor element is held in place, but the photosensitive resin hinders the coating agent from filling the eroded portions, resulting in void formation
Solution Approach 1:
The protective layer is formed before applying the photosensitive resin, creating a pre-filled structure that prevents void formation. The coating agent can penetrate through the protective layer to fill spaces without being hindered by the photosensitive resin, while the photosensitive resin still performs its securing function
Solution Approach 2:
The patent segments the protective layer formation from the photosensitive resin application, allowing the coating agent to access eroded portions through the protective layer while the photosensitive resin remains intact for securing the semiconductor element
3Ease of manufacture
If voids are formed in eroded portions, then the structure appears complete, but thermal expansion of the voids damages the semiconductor element when temperature increases
Solution Approach 1:
The protective layer provides beforehand cushioning by preventing void formation in the first place. It creates a barrier that allows the coating agent to fill eroded portions completely, eliminating the source of thermal expansion damage before it can occur
Solution Approach 2:
The patent converts the potential harm of solvent erosion into a benefit by using the protective layer to control the erosion process. The protective layer allows controlled filling of spaces with coating agent, transforming what would be void-forming erosion into an opportunity for complete space filling and void prevention
4Productivity
If reflow is performed in component mounting process, then moisture in voids expands causing damage, but without voids the process can proceed safely
Solution Approach 1:
The protective layer provides beforehand cushioning against moisture expansion during reflow. By preventing void formation in the first place, it eliminates the source of pressure buildup that would occur during reflow, allowing the process to complete safely without damage
5Ease of manufacture
If metal ions move via voids, then ion migration occurs causing insulation failure, but with protective layer ion migration is prevented
Solution Approach 1:
The protective layer acts as an intermediary barrier that prevents metal ions from migrating through the structure. It blocks the path that ions would take through voids, thereby preventing ion migration and maintaining insulation integrity between signal lines
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents void formation, enhancing the reliability and durability of semiconductor devices by reducing thermal and moisture-related damage and ion migration issues.
Implementation Method 1
an exposure process to change the solubility of the photosensitive resin through emission of ultraviolet light
Implementation Method 2
a development process to remove the photosensitive resin with a particular solvent
Data Source
AI summary
Void formation in a semiconductor device is to be prevented. The semiconductor device includes a semiconductor element, signal lines, and a protective layer. In the semiconductor device, the semiconductor element is mounted on a substrate. The signal lines in the semiconductor device are connected to the semiconductor element on the substrate. Further, the protective layer in the semiconductor device is provided in an inter-line region interposed between both edges of two adjacent signal lines among the signal lines on the substrate.