Semiconductor Package Interconnect Pre-Assembly for High I/O Density
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Solution Overview
Problem
In semiconductor device packaging, there is a challenge in achieving higher I/O count in package-on-package configurations without increasing the package footprint or adding significant cost or process steps, particularly in minimizing material usage and optimizing the size of electronic products.
Innovation Solution
The use of a substrate pre-place via assembly with multi-layer interconnects and conductive connectors, such as solder balls, allows for conductive paths to electrical contacts on the top side of semiconductor device packages, including areas devoid of contacts, by forming stacked pre-assembly structures that can be affixed without increasing the footprint or adding complex buildup processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If package-on-package configurations are used to increase I/O count, then the number of electrical contacts increases, but the package footprint increases
Solution Approach 1:
The patent utilizes multi-layer substrate construction with signal conduits extending through multiple layers, transitioning the electrical contact arrangement from a two-dimensional planar layout to a three-dimensional stacked configuration. This allows electrical contacts to be distributed across multiple layers (top, bottom, and intermediate layers), increasing the effective I/O count without expanding the horizontal footprint of the package.
Solution Approach 2:
The patent implements a nested structure where multiple substrate layers are stacked vertically, with each layer containing electrical contacts and signal conduits. The layers are interconnected through through-substrate vias and conductive elements, creating a compact nested arrangement that maximizes the number of electrical contacts within a confined horizontal space, thereby increasing I/O count without increasing package footprint.
2Quantity of substance
If complex buildup processes are added to achieve higher I/O count, then the number of electrical contacts increases, but the manufacturing complexity increases
Solution Approach 1:
The patent divides the substrate into multiple discrete layers, each with its own set of electrical contacts and signal conduits. This segmentation allows for modular manufacturing where each layer can be prepared and tested independently before assembly, reducing the overall manufacturing complexity despite the increased I/O count. The segmented structure also facilitates easier routing and connection planning.
Solution Approach 2:
The patent incorporates preliminary routing of signal conduits through the multi-layer substrate during the manufacturing process, rather than adding complex interconnect structures after assembly. Through-substrate vias and conductive pathways are pre-formed in each layer, and electrical contacts are pre-positioned, which simplifies the final assembly process and reduces manufacturing complexity while achieving high I/O count.
Data Source
AI summary
A semiconductor device package and method of manufacturing is provided. An interconnect pre-assembly includes a first frame having a plurality of first signal conduits affixed to a second frame having a plurality of second signal conduits embedded in a second substrate forming an electrical coupling between one or more first signal conduits and one or more of the second signal conduits. One or more conductive balls are connected to the one or more second signal conduits. The interconnect pre-assembly is placed over a semiconductor die, having at least one of the first conductive balls disposed over the semiconductor die. An encapsulant encapsulates the interconnect pre-assembly, the semiconductor die, and the one or more conductive balls, such that a portion of the one or more first conductive balls is exposed at a top surface of the encapsulant.