3D Semiconductor Interface for Stable Signal Latency
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Solution Overview
Problem
Current 3D semiconductor device packaging technologies face challenges in achieving efficient communication between a master chip and multiple slave chips, particularly in maintaining stable and predictable signal latency for effective data transmission in compact structures.
Innovation Solution
The implementation of a 3D semiconductor device interface with a master interface and slave interfaces, including a clock route, allows for efficient communication by transmitting commands and selecting slave identifications, enabling reliable and synchronized data exchange between the master and slave chips through a bi-directional bonding structure with TSVs and hybrid bond patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple slave chips are stacked vertically to increase functionality, then the device can support more applications and higher integration, but maintaining stable and predictable signal latency between master and slave chips becomes difficult
Solution Approach 1:
The patent pre-establishes dedicated signal transmission paths and routes between the master chip and each slave chip during the packaging design phase. By predetermined routing and establishing fixed transmission channels before operation, the system ensures consistent signal latency without requiring real-time adjustment, thus resolving the contradiction between high functionality and stable latency.
2Area of stationary object
If chips are stacked in 3D configuration to reduce footprint, then device area is reduced, but communication efficiency and signal stability between stacked chips deteriorate
Solution Approach 1:
The patent transitions from traditional 2D planar communication to 3D vertical communication by establishing dedicated signal routes through the vertical stacking dimension. Through-silicon vias (TSVs) and inter-chip connectors are used to create direct vertical transmission paths, enabling efficient communication in the third dimension while maintaining compact footprint.
Solution Approach 2:
The communication interface is segmented into dedicated signal paths for different functions (data transmission, clock signals, control signals) between master and slave chips. Each signal type has its own optimized route, which maintains communication efficiency by preventing signal interference and enabling independent optimization of each transmission channel.
3Ease of manufacture
If traditional packaging interfaces are used for 3D stacked chips, then manufacturing is simpler, but communication performance and data transmission reliability are insufficient
Solution Approach 1:
The patent designs a universal interface structure that handles multiple communication functions (data bus, address bus, control signals, clock synchronization) through a single integrated packaging architecture. The same physical interface structure supports both simple manufacturing processes and high-performance communication requirements by consolidating multiple functions into unified connection elements.
Data Source
AI summary
An interface for a semiconductor device is provided. The semiconductor device has a master device and multiple slave devices as stacked up with electric connection. The interface includes a master interface, implemented in the master device and including a master interface circuit with a master bond pattern. Further, a slave interface is implemented in each slave device and includes a slave interface circuit with a slave bond pattern to correspondingly connect to the master bond pattern. A clock route is to transmit a clock signal through the master interface and the slave interface. The master device transmits a command and a selecting slave identification through the master interface to all the slave interfaces. One of the slave devices corresponding to the selecting slave identification executes the command and responds a result back to the master device through the slave interfaces and the master interface.