Semiconductor Module Interface for Memory Access Without Extra Terminals
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Solution Overview
Problem
Conventional semiconductor devices packaged in sensor modules cannot access nonvolatile memory after packaging due to terminal limitations, making it impossible to adjust circuit characteristics or diagnose faults post-packaging.
Innovation Solution
A semiconductor device with an interface for data communication and a detector to monitor output terminals, allowing data communication using existing power or output terminals when a terminal is in a non-normal state, enabling access to memory without additional terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the number of external terminals is minimized to meet general sensor module requirements, then the module can be provided with necessary minimum terminals for power source, ground, and output, but the communication terminals of the semiconductor device cannot be assigned to external terminals, making memory access impossible after packaging
Solution Approach 1:
The patent makes existing terminals (power source terminal and output terminals) serve dual functions: their primary function (power supply and signal output) and a secondary function (data communication for memory access). The interface circuit detects terminal usage states and switches between normal operation mode and data communication mode, enabling the same physical terminals to perform multiple roles without increasing terminal count
Solution Approach 2:
The patent implements dynamic terminal functionality through a detector that monitors terminal states and an interface that switches between different operational modes. The terminals transition from static single-function assignments to dynamic multi-function assignments based on real-time detection of non-normal states, allowing adaptive reuse of terminal resources
2Manufacturing precision
If communication terminals are not assigned to external terminals due to terminal limitations, then the module can maintain a compact terminal structure, but the nonvolatile memory can only be accessed before packaging and circuit characteristic deviation cannot be compensated after packaging
Solution Approach 1:
The patent prepares the interface circuit and detector in advance to enable future memory access operations. The circuit is designed with built-in detection capabilities that will identify when terminals are available for data communication, allowing post-packaging trimming data writing to compensate for circuit characteristic deviations without requiring additional terminals or complex external equipment
3Ease of repair
If only minimum necessary terminals are provided for power source and output, then the module structure remains simple, but failure diagnosis cannot determine whether the failure is in the sensor element or in the semiconductor device
Solution Approach 1:
The semiconductor device performs self-diagnosis by using its own interface circuit and detector to monitor the state of its output terminals. The system can independently detect whether terminals are in non-normal states and initiate data communication modes for self-testing, eliminating the need for complex external diagnosis equipment while enabling detailed failure analysis between sensor element and semiconductor device components
Data Source
AI summary
A semiconductor device is packaged in a module and includes an interface arranged to perform data communication with outside of the device, and a detector arranged to detect whether or not a module output terminal is in a non-normal state. The module has a module power source terminal and a module output terminal, but has no data communication dedicated terminal. When the module output terminal is in the non-normal state, the interface uses the module output terminal or the module power source terminal so as to proceed to a module data communication mode for data communication with outside.