Semiconductor Device With Interleaved Source And Drain Fingers

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Solution Overview

Problem

Conventional semiconductor devices, such as FETs, face limitations in current flow due to tolerable current density, restricting the output power and requiring larger electrode sizes, which complicates downsizing and increases signal loss.

Innovation Solution

The semiconductor device features source and drain electrodes with stepwise side portions and symmetrical shapes, along with bent gate electrodes, to maintain constant current flow and reduce size, while increasing the number of steps and gate electrodes to enhance output power and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the electrode size is increased to handle higher current, then the tolerable current density is improved, but the device size increases and signal loss increases

Engineering Contradiction:
Improvetolerable current densityVSAvoiddevice size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The source and drain electrodes are divided into multiple fingers (source fingers and drain fingers) that are interleaved with gate electrodes. This segmentation allows the current to be distributed across multiple parallel paths, increasing the total tolerable current density without requiring a single large electrode, thus maintaining compact device size.

Inventive Principle:
Principle #1Segmentation

2Reliability

If the electrode size is increased to handle higher current, then the tolerable current density is improved, but signal loss increases

Engineering Contradiction:
Improvetolerable current densityVSAvoidsignal loss
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

By segmenting the electrodes into multiple fingers, the current density is distributed evenly across all finger paths. This prevents localized overheating and reduces resistive losses, thereby minimizing signal loss while maintaining high current handling capability.

Inventive Principle:
Principle #1Segmentation

3Reliability

If multi-finger arrangement is used to increase current capacity, then the tolerable current density is improved, but device complexity increases

Engineering Contradiction:
Improvetolerable current densityVSAvoidelectrode arrangement complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The source fingers, drain fingers, and gate electrodes are merged into a single interleaved multi-finger structure. This integrated arrangement achieves high current capacity through multiple current paths while maintaining a compact and relatively simple overall device layout, avoiding the need for separate complex electrode systems.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS8592919B2Semiconductor device with source and drain fingers
Publication Date: 2013.11.26 SUMITOMO ELECTRIC INDUSTRIES LTD
  • US8592919B2 patent drawing
  • US8592919B2 patent drawing
  • US8592919B2 patent drawing

AI summary

A semiconductor device includes source electrodes having source fingers, drain electrodes having drain fingers, and gate electrodes having bent portions between steps formed in stepwise side portions of source fingers and steps formed in stepwise side portions of drain fingers and being bent in the bent portions along the source fingers and the drain fingers. A shape of the stepwise side portion of one source finger and that of the stepwise portion of the corresponding drain finger are symmetrical about a midpoint of an imaginary line that connects the other end of the source finger and the other end of the corresponding drain finger.