Semiconductor Package Interlocked Connection Delamination
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Solution Overview
Problem
Semiconductor packages face delamination issues due to thermal expansion coefficient mismatches between materials, leading to humidity and contaminant ingress and catastrophic failures, especially at lower temperatures, with conventional solutions being ineffective in expanding the operating temperature range.
Innovation Solution
The introduction of protrusions on the support substrate or block that extend into the encapsulation material, forming an interlocked connection to increase the tensile strength of the interface, strategically placed at delamination weak points to prevent separation and enhance the package's temperature range operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional solutions (roughening surface or using adhesion promoter) are used to address delamination, then package cost increases, but the operating temperature range is not meaningfully increased especially towards lower temperatures
Solution Approach 1:
The support substrate side is segmented into multiple protrusions that extend into the encapsulation material. This segmentation creates multiple interlocked connection points distributed across the interface, preventing delamination more effectively than a single continuous surface treatment while avoiding the cost of adhesion promoters or surface roughening processes.
Solution Approach 2:
The solution transitions from a two-dimensional surface treatment (roughening or adhesion promoter coating) to a three-dimensional interlocked structure. The protrusions extend into the encapsulation material, creating mechanical interlocking in the depth dimension that significantly enhances delamination resistance without increasing manufacturing complexity.
2Temperature
If conventional solutions are used to address delamination, then manufacturing process is simplified, but the package cannot operate reliably at lower temperatures due to delamination
Solution Approach 1:
The protrusions are designed with specific geometric parameters (height, width, spacing, and profile shape) that optimize their ability to resist delamination forces at low temperatures. By carefully controlling these parameters, the interlocked connection maintains package integrity across an extended temperature range from -40°C to 125°C and beyond.
Solution Approach 2:
The interface between the support substrate and encapsulation material creates a composite structure with enhanced mechanical properties. The combination of the rigid support substrate protrusions and the encapsulation material forms an interlocked composite that resists thermal stress and delamination forces better than either material alone.
3Device complexity
If no protrusions are used, then the package structure is simple, but delamination occurs at the interface between encapsulation material and support substrate at lower temperatures
Solution Approach 1:
The support substrate side is segmented into multiple protrusions that extend into the encapsulation material. This segmentation creates multiple interlocked connection points distributed across the interface, preventing delamination more effectively than a single continuous surface treatment while avoiding the cost of adhesion promoters or surface roughening processes.
Solution Approach 2:
The solution transitions from a two-dimensional surface treatment (roughening or adhesion promoter coating) to a three-dimensional interlocked structure. The protrusions extend into the encapsulation material, creating mechanical interlocking in the depth dimension that significantly enhances delamination resistance without increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The interlocked connections effectively prevent delamination, maintaining the integrity of the semiconductor package interfaces at lower temperatures, thereby preventing failures and allowing operation within a wider temperature range without delamination-type failures.
Implementation Method 1
A protrusion extends outward from a side of the support substrate and terminates in the encapsulation material. The protrusion forms an interlocked connection with the encapsulation material.
Implementation Method 2
The interlocked connection increases the tensile strength of the interface between the encapsulation material and the side of the support substrate with the protrusion.
Data Source
AI summary
A semiconductor package includes a block having opposing first and second main surfaces and sides between the first and second main surfaces, and an encapsulation material at least partly covering the block. One or both of the main surfaces of the block has recessed regions. The recessed regions do not extend completely through the block from one main surface to the other main surface. The encapsulation material fills the recessed regions to form an interlocked connection between the block and the encapsulation material. Additional semiconductor package embodiments are provided.