Semiconductor Device With Interlocking Bonding And Probe Pads
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Solution Overview
Problem
Current semiconductor devices face challenges in achieving high integration and small package thickness while maintaining good electrical connections, and existing probe testing methods can cause contact marks on bonding pads, affecting the reliability of electrical connections.
Innovation Solution
The semiconductor device design includes a configuration of bonding pads, probe pads, and connection pads arranged in an interlocking manner with spaces between them, using bonding wires to connect these pads, allowing for efficient use of space, reducing package thickness, and preventing contact marks during probe testing by isolating bonding pads from the probe.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If probe testing is conducted by bringing a probe into contact with the bonding pad, then electrical connection reliability can be tested, but contact marks are created on the bonding pad that affect subsequent wire bonding quality
Solution Approach 1:
The patent divides the testing function from the bonding function by introducing separate probe pads that are distinct from the bonding pads. This segmentation allows the probe to test electrical connections without creating contact marks on the bonding pads, thereby maintaining both measurement accuracy and subsequent bonding reliability.
Solution Approach 2:
The probe pads serve as an intermediary element between the probe and the bonding pads. The probe contacts the probe pads for testing, and separate bonding wires connect the probe pads to the bonding pads, thus mediating the testing process to prevent direct probe-bonding pad contact that would cause harmful contact marks.
2Productivity
If bonding pads are arranged densely to achieve high integration, then device functionality increases, but space for probe testing and wire bonding becomes insufficient
Solution Approach 1:
The probe pads serve multiple functions: they enable probe testing of electrical connections and also serve as connection points for bonding wires. This multi-functionality allows the chip to achieve high integration by using the same pad structures for both testing and bonding purposes, optimizing space utilization.
Solution Approach 2:
The patent arranges bonding pads, probe pads, and connection pads in an interlocking pattern that efficiently utilizes two-dimensional space. By optimizing the spatial arrangement in the planar dimension, the design achieves high integration density while maintaining sufficient space for all necessary pad functions and wire routing.
3Length of stationary object
If package thickness is reduced to achieve compact devices, then device size decreases, but space for wire bonding and pad arrangement becomes limited
Solution Approach 1:
The patent segments the pad functions into bonding pads, probe pads, and connection pads arranged in distinct but interlocking regions. This segmentation allows for optimized vertical stacking and reduced package thickness while maintaining adequate horizontal space for wire bonding operations.
Solution Approach 2:
By optimizing the two-dimensional arrangement of pads in an interlocking pattern, the design compensates for reduced vertical space. The efficient planar utilization allows sufficient space for wire bonding and pad functions even when package thickness is minimized.
Data Source
AI summary
A semiconductor device includes a substrate, a semiconductor chip, a plurality of bonding pads on a surface of the semiconductor chip, a plurality of probe pads on a surface of the semiconductor chip, a plurality of connection pads on a surface of the substrate, and a plurality of bonding wires that electrically connect the bonding pads and the connection pads. The plurality of bonding pads include a first bonding pad and a second bonding pad, the plurality of probe pads include a first probe pad and a second probe pad, and a part of the first probe pad is disposed between the second bonding pad and the second probe pad.