Semiconductor Package with Interlocking Passive Components
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for manufacturing semiconductor device packages are inefficient due to time-consuming pick and place operations for individual electronic components, which can shift or rotate during the manufacturing process, leading to alignment issues and decreased yield rates.
Innovation Solution
The solution involves shaping the surfaces of electronic components to have recessing and protruding portions that match in contour, allowing multiple components to be combined as an integrated module before placement in a cavity, thereby increasing efficiency and fixing their positions for improved alignment and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If individual electronic components are handled one by one in pick and place operations, then each component can be precisely positioned, but the manufacturing process becomes time-consuming and inefficient
Solution Approach 1:
Multiple electronic components are combined into a single integrated module before being placed in the cavity. The module includes a first electronic component and a second electronic component that are mechanically coupled together, allowing them to be handled and positioned as one unit rather than individually, thus improving manufacturing efficiency while maintaining precision
Solution Approach 2:
The electronic components are pre-assembled into an integrated module with recessing and protruding portions that enable mechanical coupling. This preliminary assembly ensures proper alignment and positioning is established before the final placement in the cavity, preventing alignment issues during the manufacturing process
2Reliability
If individual electronic components are placed separately in cavities, then each component can be positioned, but components may shift or rotate during manufacturing leading to alignment issues
Solution Approach 1:
Multiple electronic components are merged into a single integrated module that is placed as one unit in the cavity. This eliminates the risk of individual components shifting or rotating during subsequent manufacturing steps, as the components are already mechanically coupled and positioned relative to each other
Solution Approach 2:
The integrated module employs asymmetric recessing and protruding portions with substantially matched contours. The protruding portion of one component fits into the recessing portion of another, creating a mechanically interlocked structure that prevents rotation and shifting while maintaining simple assembly
Data Source
AI summary
A semiconductor device package includes a first passive component having a first surface and a second passive component having a second surface facing the first surface of the first passive component. The first surface has a recessing portion and the second surface includes a protruding portion within the recessing portion of the first surface of the first passive component. A contour of the protruding portion and a contour of the recessing portion are substantially matched. A method of manufacturing a semiconductor device package is also disclosed.