Semiconductor Device Interposer Connection Verification
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor manufacturing methods result in excessive scrapped components due to inadequate testing during the process, leading to unnecessary discarding of defective semiconductor devices.
Innovation Solution
A manufacturing method that involves testing semiconductor devices in the middle of the manufacturing process by mounting one semiconductor die on an interposer, allowing for the detection of defects and preventing additional components from being mounted on defective devices, thereby improving yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If testing is performed only after complete assembly, then manufacturing process is simpler, but defective devices continue to be processed wasting materials and time
Solution Approach 1:
The patent performs electrical connection testing after mounting the first semiconductor die on the interposer, but before mounting additional dies or completing packaging. This preliminary testing action identifies defective devices early in the manufacturing process, preventing waste of subsequent semiconductor dies, underfill materials, and packaging resources that would otherwise be consumed on faulty devices.
2Productivity
If multiple semiconductor dies are mounted before testing, then productivity increases, but defective devices cannot be identified until later causing more waste
Solution Approach 1:
The patent segments the manufacturing process into distinct phases with testing at an intermediate stage. Instead of treating the entire assembly process as a single batch operation, the method divides it into: (1) mounting first die and testing, (2) mounting additional dies only to passing devices, and (3) final packaging. This segmentation enables early defect detection while maintaining efficient batch processing for non-defective devices.
3Loss of substance
If testing is performed early in the process, then waste is reduced, but additional process steps and time are required
Solution Approach 1:
The patent performs the electrical connection test at the optimal point in the manufacturing process - after the first semiconductor die is mounted and electrical connections are established, but before applying underfill material and mounting additional dies. This timing allows early defect detection to prevent waste of underfill material and subsequent processing steps, while the test itself integrates smoothly into the existing manufacturing flow without requiring separate dedicated test equipment or process interruptions.
Data Source
AI summary
A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise connection verification for a first one or more mounted components prior to additional assembly.