Semiconductor Interposer Structure for Lateral-Side Interconnection
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Solution Overview
Problem
Current semiconductor interposer structures are limited in their ability to make electrical connections between electronic components mounted on lateral sides, as they typically only facilitate connections between components on top and bottom surfaces.
Innovation Solution
A semiconductor interposer device with a body having multiple lateral surfaces, each with distinct electrical contacts, allowing for electrical connections between electronic components mounted on different lateral surfaces through an interconnection structure, enabling connections between components on first, second, and third lateral surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional interposer structures are used with connections only on top and bottom surfaces, then the structure is simple, but the packaging density and functionality are limited
Solution Approach 1:
The patent extends electrical connections from the traditional top-bottom (vertical) dimension to include lateral surfaces (horizontal dimension). By providing electrical contacts on multiple lateral surfaces of the interposer body, the invention enables electronic components to be mounted on lateral sides and establishes interconnections in additional spatial dimensions, thereby increasing packaging density without proportionally increasing structural complexity
Solution Approach 2:
The interposer body is designed with electrical contacts on multiple surfaces (top, bottom, and lateral surfaces), enabling it to perform multiple functions: connecting components on top and bottom surfaces as well as connecting components on lateral surfaces. This multi-functional design allows a single interposer structure to support various mounting configurations and interconnection patterns, enhancing versatility while maintaining structural integration
2Adaptability or versatility
If electrical contacts are added on lateral surfaces of the interposer, then connectivity between lateral components is enabled, but manufacturing complexity increases
Solution Approach 1:
The electrical connection system is segmented into multiple independent contact groups located on different surfaces of the interposer body. Each lateral surface can have its own set of electrical contacts that are independently configured and connected to specific circuit regions within the interposer. This segmentation allows for modular manufacturing approaches where different contact patterns can be implemented on different surfaces using standardized processes, reducing overall manufacturing complexity despite the increased number of contacts
Data Source
AI summary
A semiconductor device is provided. The semiconductor device includes a body and an interconnection structure. The body has a first lateral surface and a second lateral surface angled relative to the first lateral surface. The interconnection structure is configured to make electrical connection between the semiconductor device and a first electronic component mounted to the first lateral surface of the body of the semiconductor device and to make electrical connection between the semiconductor device and a second electronic component mounted to the second lateral surface of the body of the semiconductor device.