Semiconductor Package With Interposer Substrate Between Stacked Layers

The patent transitions from a single-substrate planar arrangement to a three-dimensional stacked architecture with multiple substrates (first substrate, second substrate, third substrate) connected vertically. This dimensional change allows connection terminals to be distributed across different height levels, enabling varying pitches and patterns on each substrate layer while maintaining a compact overall footprint, thus resolving the contradiction between connection reliability and package size.

The patent implements a nested substrate structure where the second substrate is positioned between the first and third substrates, creating a compact stacked configuration. This nesting arrangement allows multiple connection terminal arrays with different pitches to be integrated in a vertically stacked manner, achieving reliable electrical connections without proportionally increasing the horizontal package area.

The patent divides the connection terminal structure into multiple independent substrate layers (first, second, and third substrates), each capable of having its own pitch and pattern configuration. This segmentation allows each substrate layer to be independently optimized for specific terminal arrangements, providing flexibility and adaptability within a compact stacked package structure.

By stacking multiple substrates vertically, the patent creates additional design freedom in the vertical dimension. Each substrate layer can accommodate different terminal pitches and patterns, and the vertical stacking allows these varied arrangements to coexist in a compact footprint, thereby maintaining terminal arrangement flexibility while achieving package miniaturization.

The patent segments the circuit configuration into multiple substrate layers, each with its own pitch and pattern characteristics. This segmentation enables different circuit configurations to be implemented on different layers, enhancing design diversity. The modular nature of segmented substrates actually simplifies the design process compared to attempting to integrate all configurations on a single complex substrate.

The vertical stacking of multiple substrates with different pitches provides an additional design dimension for circuit configuration. Instead of complicating a single substrate layout, the patent distributes different pitch configurations across multiple vertical layers, achieving circuit diversity while maintaining relatively simple individual substrate designs and simplifying the overall manufacturing process.