Semiconductor Package Interposer Thermal Conduction Path
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Solution Overview
Problem
As electronic devices generate more heat due to improved performance, existing methods that limit performance to manage heat dissipation become inefficient, hindering device efficiency.
Innovation Solution
A semiconductor package design featuring a layered structure with a lower and upper package, an interposer, and heat-transfer layers to create a thermal connection path, utilizing thermal interface materials and conductive connecting portions to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If performance of electronic devices is improved, then processing power and functionality are enhanced, but heat generation is increased
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional vertical heat transfer by stacking multiple semiconductor packages and heat transfer layers in the vertical dimension. This allows heat to be conducted upward through the interposer and heat transfer layers rather than relying solely on lateral dissipation, effectively managing heat from high-power devices without limiting performance.
Solution Approach 2:
The patent introduces an interposer substrate with embedded heat transfer paths and thermal interface materials as intermediary components between the semiconductor chip and the upper package. These intermediaries provide dedicated thermal conduction pathways that separate heat transfer from electrical signal transmission, enabling efficient heat removal while maintaining electrical functionality.
2Temperature
If performance is limited to manage heat dissipation, then heat management is simplified, but device efficiency is reduced
Solution Approach 1:
The patent segments the heat dissipation function from the electrical connection function by using an interposer substrate with separate heat transfer paths. This segmentation allows the system to maintain full performance while heat is managed through dedicated thermal pathways, eliminating the need to limit device performance for thermal control.
3Temperature
If multiple heat transfer layers and interposers are added, then heat dissipation capability is improved, but device complexity is increased
Solution Approach 1:
The patent merges multiple functions into the interposer substrate: electrical interconnection, mechanical support, and thermal management. By integrating heat transfer paths within the interposer's existing layered structure and using the upper package substrate as both electrical and thermal management component, the design reduces overall system complexity despite enhanced heat dissipation capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively transfers heat from the semiconductor chips through the interposer, improving heat-dissipation characteristics and maintaining electrical connectivity, thus enhancing device efficiency without performance limitations.
Implementation Method 1
a lower heat-transfer layer disposed on the lower semiconductor chip... The lower heat-transfer layer may be provided in the first heat-transfer opening to be in contact with the upper interposer heat-transfer pad
Implementation Method 2
an upper heat-transfer layer disposed on the upper interposer heat-transfer pad... the upper heat-transfer layer may be provided in the third heat-transfer opening to be in contact with the upper package heat-transfer pad
Implementation Method 3
the lower heat-transfer layer has a thickness that may be equal to or larger than a depth of the first heat-transfer opening... formed of a thermal interface material
Data Source
AI summary
Provided is a semiconductor package including a lower package, an interposer on the lower package, and an upper package on the interposer. The lower package may include a lower package substrate, a lower semiconductor chip on the lower package substrate, and a lower heat-transfer layer on the lower semiconductor chip. The interposer may include an interposer substrate, first and second heat-transfer openings defined by recessed bottom and top surfaces, respectively, of the interposer substrate, an upper interposer heat-transfer pad disposed in the second heat-transfer opening, and an upper heat-transfer layer disposed on the upper interposer heat-transfer pad. The upper package may include an upper package substrate, an upper package heat-transfer pad, which may be disposed in a third heat-transfer opening defined by a recessed bottom surface of the upper package substrate, and an upper semiconductor chip disposed on the upper package substrate.