Semiconductor Substrate Singulation via Inverted Sawing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in semiconductor device manufacturing lies in the complexity and damage susceptibility during singulation processes, particularly due to the generation of small chips from the molding compound during cutting, which can cause cracking and delamination of the silicon substrate, leading to reliability issues and yield loss.
Innovation Solution
The approach involves flipping the semiconductor device so that the substrate layer is faced upward and the molding is cut after the substrate, preventing chips from the molding from damaging the substrate during sawing, and using blades of different widths to minimize stress and damage, resulting in a semiconductor device with improved reliability and reduced yield loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the semiconductor device is sawed and singulated from a carrier using conventional methods, then the semiconductor device can be individualized for subsequent assembling operations, but the semiconductor device is easily damaged during the singulation operations due to the generation of small chips from the molding compound that cause cracking and delamination of the silicon substrate
Solution Approach 1:
The patent applies the inversion principle by flipping the semiconductor device over before performing the sawing operation. Instead of cutting the molding compound while the substrate is facing upward, the device is inverted so the substrate faces upward and the molding compound is cut from the opposite side. This prevents chips generated during cutting from falling onto and damaging the substrate, thereby resolving the contradiction between ease of manufacture and substrate integrity.
Solution Approach 2:
The patent uses a support structure as an intermediary during the sawing process. The support structure holds the semiconductor device in the inverted position and provides a stable platform for the sawing operation. This intermediary element enables the inverted cutting approach while ensuring proper positioning and support throughout the process, maintaining both manufacturing ease and substrate integrity.
2Productivity
If the molding is cut before the substrate layer, then the cutting process can be completed in sequence, but chips from the molding compound can damage the substrate layer causing cracking and delamination
Solution Approach 1:
The patent reverses the conventional cutting sequence by inverting the device before cutting. The molding compound is cut while the substrate faces upward, which maintains cutting efficiency while preventing chip damage to the substrate. This inversion resolves the contradiction between productivity and manufacturing precision by changing the orientation rather than the sequence of operations.
3Device complexity
If blades of uniform width are used for cutting, then the cutting process is simple, but stress and damage occur during sawing due to the small and dense area of the semiconductor device
Solution Approach 1:
The patent applies the local quality principle by using blades of different widths at different locations or for different cutting stages. Instead of using uniform blades throughout, the cutting process employs appropriately sized blades for specific cutting requirements, reducing stress on the small semiconductor device while maintaining process simplicity. This resolves the contradiction between device complexity and reliability by optimizing blade selection for local cutting needs.
Data Source
AI summary
A semiconductor device includes a substrate layer, a redistribution layer (RDL) disposed over the substrate layer, a conductive bump disposed over the RDL, and a molding disposed over the RDL and surrounding the conductive bump, wherein the molding includes a protruded portion laterally protruded from a sidewall of the substrate layer and away from the conductive bump.