Semiconductor I/O Cell Array Design for Power Supply and Area Optimization

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Solution Overview

Problem

As semiconductor devices miniaturize and the number of integrated elements increases, the number of I/O cells decreases due to the need for multiple stages of power and ground potential supply cells, limiting the arraying of I/O cells.

Innovation Solution

A semiconductor device design that includes a multilayer interconnect layer with outer and inner peripheral cell columns, where potential supply cells are strategically placed and connected through interconnects to supply power and ground potential to both columns, allowing for a larger number of I/O cells without requiring power and ground potential supply cells in every stage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple stages of power and ground potential supply cells are provided in each stage, then power and ground potential supply is ensured, but the number of I/O cells decreases

Engineering Contradiction:
Improvepower and ground potential supplyVSAvoidnumber of I/O cells
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent transitions from a single-stage array to a multiple-stage array configuration, utilizing vertical stacking of cell stages. Power and ground potential supply cells are strategically positioned in specific stages (first and last stages) while intermediate stages contain only I/O cells, achieving comprehensive power supply across all stages without requiring power cells in every stage. This dimensional expansion resolves the contradiction by maintaining reliable power supply while maximizing I/O cell quantity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a unified power supply architecture where power potential supply cells and ground potential supply cells in the first and last stages serve multiple intermediate stages simultaneously through interconnect layers. This multi-functional design allows a single power cell to support multiple stages, reducing the total number of power cells needed while ensuring reliable power and ground potential supply to all I/O cells across all stages.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Quantity of substance

If cells are arrayed in multiple stages, then the number of I/O cells increases, but the complexity of power supply interconnects increases

Engineering Contradiction:
Improvenumber of I/O cellsVSAvoidcomplexity of power supply interconnects
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent divides the multiple-stage cell array into distinct segments: first stage with power and ground cells, intermediate stages with only I/O cells, and last stage with power and ground cells. This segmentation creates a modular structure where each stage can be independently designed and connected through standardized interconnect layers, reducing overall system complexity while enabling high I/O cell density.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces interconnect layers as intermediary structures between cell stages. These interconnect layers act as mediators that systematically route power and ground potentials from the first and last stages to all intermediate stages, simplifying the power distribution architecture and reducing the complexity of direct point-to-point connections that would otherwise be required.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If power potential supply cells and ground potential supply cells are provided in each stage, then power supply reliability is improved, but the chip area occupied by non-I/O cells increases

Engineering Contradiction:
Improvepower supply reliabilityVSAvoidchip area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent merges the power supply function across multiple stages by consolidating power potential supply cells and ground potential supply cells into the first and last stages only. This merging approach allows a single set of power cells to serve all intermediate stages through the interconnect architecture, significantly reducing the total chip area occupied by power cells while maintaining reliable power supply to all I/O cells across all stages.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS9589893B2Semiconductor device, semiconductor device design method, semiconductor device design apparatus, and program
Publication Date: 2017.03.07 RENESAS ELECTRONICS CORP
  • US9589893B2 patent drawing
  • US9589893B2 patent drawing
  • US9589893B2 patent drawing

AI summary

A semiconductor device includes a semiconductor chip, which includes a substrate, a multilayer interconnect layer formed over the substrate, a first cell column disposed along an edge of the substrate in a plan view, the first cell column having a first I/O cell and a first power supply cell, second cell column disposed along the first cell column in plan view, the second cell column having a second I/O cell, a first pad supplying a first supply voltage to the first power supply cell, a first voltage supply wire disposed over the first cell column, a second voltage supply wire disposed over the second cell column, and a first connection wire crossing the first voltage supply wire and the second voltage supply wire.