Semiconductor Module Assembly Jig for High-Density Chip Positioning

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Solution Overview

Problem

Conventional semiconductor module manufacturing methods face challenges in preventing semiconductor chips from slipping during high-density mounting due to inadequate positioning and interference issues with existing assembly jig sets.

Innovation Solution

An assembly jig set comprising a first outer frame jig, inner piece jigs with sectioned shapes and opening portions for positioning semiconductor chips, and a partition plate made of carbon fiber composite material, which allows for improved positioning and attachment of semiconductor chips on an insulation substrate, enhancing workability and accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional assembly jigs are used for semiconductor module manufacturing, then the assembly process can be performed, but semiconductor chips slip during high-density mounting due to inadequate positioning

Engineering Contradiction:

Improvepositioning accuracy of semiconductor chipsVSAvoidstability of semiconductor chips during assembly

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The assembly jig is divided into multiple inner piece jigs (first inner piece jig, second inner piece jig, etc.) that can be independently positioned and attached to the outer frame jig. Each inner piece jig has opening portions that precisely position semiconductor chips, preventing slippage during high-density mounting while maintaining manufacturing precision

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Inner piece jigs serve as intermediary components between the outer frame jig and the semiconductor chips. These intermediaries provide precise positioning through their opening portions and are attached to the outer frame jig via outer protruding portions, ensuring both positioning accuracy and chip stability during assembly

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If multiple separate jigs are used for positioning semiconductor chips, then positioning accuracy can be improved, but the complexity of the assembly process increases

Engineering Contradiction:

Improvepositioning accuracy of semiconductor chipsVSAvoidcomplexity of assembly jig set

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

Multiple inner piece jigs are merged into a coordinated system that attaches to a single outer frame jig. The outer frame jig provides a unified attachment structure with multiple attachment portions, allowing several inner piece jigs to be positioned and secured simultaneously, reducing overall system complexity while maintaining high positioning accuracy

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The outer frame jig serves multiple functions: it provides the structural framework, contains multiple attachment portions for securing inner piece jigs, and enables coordinated positioning of multiple semiconductor chips. This multi-functionality reduces the need for separate positioning mechanisms, simplifying the overall assembly process while maintaining precision

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Productivity

If inner piece jigs are designed with multiple opening portions for high-density mounting, then chip positioning capacity increases, but the risk of chip slippage increases

Engineering Contradiction:

Improvedensity of semiconductor chip mountingVSAvoidstability of semiconductor chips during assembly

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

Each inner piece jig is segmented into specific functional portions: opening portions for positioning chips and outer protruding portions for attachment. This segmentation allows each component to perform its function optimally - the opening portions provide precise positioning for high-density mounting while the protruding portions ensure secure attachment, preventing slippage

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The inner piece jigs are designed to self-position semiconductor chips through their opening portions while simultaneously self-securing to the outer frame jig via outer protruding portions. This self-service mechanism ensures that both positioning and securing functions are automatically performed, maintaining chip stability during high-density mounting without requiring additional external mechanisms

Inventive Principle:

Principle #25Self-service

Data Source

PatentUS11935774B2Assembly jig set and manufacturing method of semiconductor module

Publication Date: 2024.03.19 FUJI ELECTRIC CO LTD

AI summary

Provided is an assembly jig set of semiconductor module having a plurality of semiconductor chips, the assembly jig set comprising: a first outer frame jig; and a plurality of inner piece jigs positioned by the first outer frame jig and each having a sectioned shape corresponding to the first outer frame jig, wherein one of the inner piece jigs has a plurality of opening portions for positioning the semiconductor chips. A manufacturing method of a semiconductor module using an assembly jig set is provided.