Semiconductor Inspection Jig Vertical Push-Up Mechanism
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor inspection jigs, poor contact between the GND block and the device's rear surface due to warping leads to inadequate heat dissipation and inaccurate measurement of device characteristics, especially when the GND block slides over a slope, causing variations in measured values.
Innovation Solution
A semiconductor inspection jig design featuring a recessed part with a GND block sandwiched by movable blocks and pushed up by springs, ensuring improved adhesion and heat dissipation by eliminating horizontal movement of the GND block, thus reducing spacing variations and stabilizing contact with the printed circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the GND block slides over a slope to improve contact with the device, then adhesion between the GND block and device rear surface improves, but spacing between the GND block and printed circuit board increases, causing measured values to fluctuate
Solution Approach 1:
Instead of sliding the GND block horizontally over a slope, the invention inverts the approach by pushing the GND block upward from below using a push-up part. This vertical pushing action achieves the same contact improvement without requiring horizontal movement, thereby maintaining consistent spacing with the printed circuit board while ensuring reliable adhesion to the device rear surface.
Solution Approach 2:
The invention transitions from horizontal sliding motion to vertical pushing motion. By changing the dimension of movement from horizontal (slope sliding) to vertical (pushing from bottom surface), the GND block achieves reliable contact with the device while maintaining stable positioning relative to the printed circuit board, eliminating measurement fluctuations.
2Ease of operation
If wide spacing is provided between the GND block and printed circuit board to enable sliding, then the GND block can slide over the slope, but contact state between the lead and transmission line varies, causing measurement fluctuations
Solution Approach 1:
The invention inverts the sliding mechanism by eliminating horizontal movement entirely. Instead of sliding the GND block over a slope, the push-up part pushes the GND block vertically from below, achieving contact improvement without requiring wide spacing or horizontal movement, thereby maintaining stable lead-to-transmission-line contact.
Solution Approach 2:
The invention extracts the essential function (improving GND block contact with device) from the sliding mechanism. By removing the horizontal sliding component and retaining only the vertical pushing action, the system achieves the desired contact state without the side effect of varying spacing and measurement fluctuations.
3Temperature
If the GND block is pushed up to improve adhesion and heat dissipation, then contact with the device rear surface improves, but the spacing with the printed circuit board must be controlled to avoid measurement variations
Solution Approach 1:
The invention introduces a dynamic pushing mechanism that can adjust the vertical position of the GND block. The push-up part applies controlled upward force to ensure optimal contact between the GND block and device rear surface for heat dissipation, while the overall structure maintains consistent spacing with the printed circuit board to prevent measurement variations.
Solution Approach 2:
The invention changes the positional parameter of the GND block from horizontal displacement to vertical displacement. By controlling the vertical pushing force and displacement through the push-up part, the system optimizes heat dissipation contact while maintaining stable spacing parameters relative to the printed circuit board, avoiding measurement precision degradation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation and reduces measurement fluctuations, enabling accurate characterization of semiconductor device characteristics by maintaining consistent contact and minimizing spacing variations between the device and the printed circuit board.
Implementation Method 1
a push-up part pushing up the GND block from a bottom surface of the recessed part
Implementation Method 2
a first press part pressing the first block against the first side face of the GND block; and a second press part pressing the second block against the second side face of the GND block
Implementation Method 3
eliminate gaps between the two, and thereby cause heat to diffuse in the horizontal direction as well, which improves a heat dissipation property
Implementation Method 4
improves a heat dissipation property of the semiconductor device
Implementation Method 5
cause heat to diffuse in the horizontal direction as well, which improves a heat dissipation property
Data Source
AI summary
A semiconductor inspection jig includes: a jig body having a recessed part provided on a top surface of the jig body; a printed circuit board provided on the top surface of the jig body; a GND block provided in the recessed part and having first and second side faces opposite to each other; first and second blocks provided in the recessed part and sandwiching the GND block; a push-up part pushing up the GND block from a bottom surface of the recessed part; a first press part pressing the first block against the first side face of the GND block; and a second press part pressing the second block against the second side face of the GND block.