Semiconductor Assembly Jig Vertical Positioning

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Solution Overview

Problem

Existing assembly jigs for semiconductor devices fail to accurately position semiconductor chips due to thermal distortion of packaging substrates, causing gaps that allow chips to slip aside during the soldering process, especially with the reduction in chip thickness and increased curvature of substrates.

Innovation Solution

The assembly jig incorporates a chip positioning piece that can move vertically and independently of the inner positioning piece, with a pipe portion length that ensures contact with the curved packaging substrate, reducing the gap between the jig and substrate to less than the sum of the chip and solder thickness, preventing positional shifts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a conventional assembly jig with a fixed inner positioning piece is used, then the structure is simple and easy to manufacture, but the positioning accuracy deteriorates due to thermal distortion of the packaging substrate creating gaps

Engineering Contradiction:

Improvepositioning accuracyVSAvoidjig structure complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The inner positioning piece is designed to move vertically relative to the outer framework, transitioning from a fixed static structure to a dynamic adjustable one. This allows the positioning piece to adapt to thermal distortion of the packaging substrate by maintaining contact through vertical movement, thereby preserving positioning accuracy without requiring an overly complex rigid structure

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The inner positioning piece is nested within the outer framework, with the chip positioning piece inserted through an opening in the inner positioning piece. This nested configuration allows the inner positioning piece to move independently vertically while remaining constrained by the outer framework, enabling adaptation to substrate distortion while maintaining overall structural simplicity

Inventive Principle:

Principle #7Nested doll (Nesting)

2Productivity

If the packaging substrate is heated for soldering, then the soldering process can be completed, but thermal distortion occurs causing the substrate to curve and create gaps

Engineering Contradiction:

Improvesoldering process completionVSAvoidsubstrate flatness

Core Design Contradiction:

ProductivityVSStability of the object's composition

Solution Approach 1:

The chip positioning piece is designed to maintain contact with the packaging substrate before and during heating. By having the positioning piece already in contact with the substrate and capable of vertical movement, the system preemptively counteracts the thermal distortion that will occur during soldering, preventing gap formation rather than correcting it after the fact

Inventive Principle:

Principle #9Preliminary anti-action

Solution Approach 2:

The chip positioning piece acts as an intermediary between the inner positioning piece and the packaging substrate. It transmits the positioning function while adapting to substrate distortion through vertical movement, mediating between the rigid positioning structure and the thermally distorting substrate

Inventive Principle:

Principle #24Intermediary (Mediator)

3Manufacturing precision

If the gap between the assembly jig and packaging substrate becomes large, then thermal distortion is accommodated, but semiconductor chips can slip aside and positioning accuracy is lost

Engineering Contradiction:

Improvechip positioning accuracyVSAvoidgap dimension

Core Design Contradiction:

Manufacturing precisionVSLength of stationary object

Solution Approach 1:

The vertical position of the inner positioning piece is made changeable through vertical movement relative to the outer framework. This parameter change allows the positioning piece to maintain optimal contact with the packaging substrate despite thermal distortion, keeping the gap dimension small enough to prevent chip slippage while accommodating substrate curvature

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design ensures accurate positioning of semiconductor chips by maintaining contact with the substrate despite thermal distortion, preventing slipping and ensuring precise alignment during soldering.

Implementation Method 1

thermal distortion of packaging substrates, causing gaps that allow chips to slip aside during the soldering process

Methodology Applied

Scientific EffectThermal distortion: Thermal Expansion

Data Source

PatentUS8759158B2Assembly jig for a semiconductor device and assembly method for a semiconductor device

Publication Date: 2014.06.24 FUJI ELECTRIC CO LTD

AI summary

In aspects of the assembly jig and method of the invention, when a packaging substrate is curved concaving upward at temperatures of melting solder, the gap between the assembly jig and the packaging substrate can be made smaller than the dimension of the sum of the thickness of the semiconductor chip and the thickness of the melted solder by allowing a part of the bottom surface of the chip positioning piece to become always, or substantially always, in contact with the upper surface of the packaging substrate owing to the weight of the chip positioning jig itself. As a consequence, the semiconductor chip does not slip aside out of the opening of the chip positioning piece. Therefore, the semiconductor chip can be positioned accurately on the packaging substrate.