Semiconductor Apparatus Joint Strength via Composite Insulator
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Solution Overview
Problem
The joint strength of semiconductor structures is compromised when a semiconductor layer includes an opening, leading to decreased reliability of semiconductor apparatus due to mechanical stress and poor bonding.
Innovation Solution
Incorporating conductor portions and an insulator portion between the semiconductor layers and the opening, with the insulator portion in contact with an insulator member, enhances the joint strength by relieving mechanical stress and improving bonding reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a semiconductor layer includes an opening, then the structure allows for electrical connection or light transmission, but the joint strength of structures decreases at the position overlapping the opening
Solution Approach 1:
The patent employs a composite structure consisting of multiple conductor portions (first and second conductor portions) combined with an insulator portion to form a reinforced joint structure. This composite arrangement compensates for the strength loss caused by the opening in the semiconductor layer, maintaining both electrical connectivity and mechanical strength at the bonding interface.
Solution Approach 2:
The conductor structure is divided into multiple segments (first conductor portion and second conductor portion) separated by an insulator portion. This segmentation allows the structure to distribute mechanical stress across multiple points rather than concentrating it at a single location, thereby improving overall joint strength while maintaining electrical connection functionality.
2Adaptability or versatility
If a semiconductor layer includes an opening, then the structure enables functional connectivity, but the reliability of the semiconductor apparatus decreases
Solution Approach 1:
The patent incorporates an insulator portion between conductor portions in advance, creating a cushioning effect that prevents direct stress concentration at the opening location. This preemptive structural reinforcement ensures that the bonding interface maintains high reliability even when subjected to mechanical stress, while still allowing the opening to fulfill its functional connectivity purpose.
Solution Approach 2:
The insulator portion acts as an intermediary element between the first and second conductor portions. It mediates the mechanical stress distribution and prevents direct load transmission through the opening area, thereby enhancing apparatus reliability while preserving the electrical connection function that the opening provides.
3Reliability
If conductor portions are disposed close to an opening, then electrical connection is improved, but mechanical stress concentration increases
Solution Approach 1:
The insulator portion serves as a mediator placed between conductor portions that are positioned near the opening. It allows the conductor portions to maintain close proximity for good electrical connection while preventing direct mechanical stress concentration between them, effectively decoupling the electrical and mechanical requirements.
Solution Approach 2:
The patent applies local quality by introducing an insulator portion specifically at the location where conductor portions are positioned near the opening. This localized structural modification addresses the stress concentration issue only where needed, without affecting the overall electrical connection quality or requiring changes to the entire conductor structure.
Data Source
AI summary
A semiconductor layer includes an opening, and in a joint surface between structures, a portion between a semiconductor layer and an opening in a direction in which the semiconductor layers are stacked together includes a plurality of conductor portions and an insulator portion located between the plurality of conductor portions in a direction orthogonal to the direction.