Semiconductor Device Joint Part for Thermal Stress Relief
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing semiconductor devices face challenges in evenly distributing current among multiple semiconductor chips due to potential imbalances, leading to electrical oscillations and reduced reliability, especially with the use of resins like silicone gel that expand and negatively affect electrical connections at high temperatures.
Innovation Solution
A semiconductor device design featuring a joint part made from the same material as the electrodes, located outside the sealing member, which electrically connects uncovered electrode parts to equalize potentials and reduce thermal expansion stress, thereby enhancing current distribution and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin such as silicone gel is used for the package, then the semiconductor chips are sealed and protected, but the expansion force of the resin at high temperatures generates negative influence on electrical connection between the semiconductor chip and electrode, thereby reducing device lifetime
Solution Approach 1:
The patent divides the electrode structure into multiple segments: electrodes inside the sealing member and electrodes outside the sealing member, connected through a joint part. This segmentation allows the external electrodes to be positioned away from the thermal expansion zone of the resin package, isolating the electrical connection path from thermal stress while maintaining sealing protection.
Solution Approach 2:
The joint part serves as an intermediary component that connects the internal electrodes (covered by sealing member) to the external electrodes (outside the sealing member). This intermediary structure transfers electrical signals while being positioned in a location less affected by resin expansion, thereby mediating between the sealed environment and the external connection points.
2Power
If multiple semiconductor chips are operated in parallel to increase capacity, then the current handling capability is improved, but potential imbalances in insulating substrates cause uneven current flow and electrical oscillations
Solution Approach 1:
The patent positions multiple electrodes outside the sealing member in a configuration that promotes equipotential distribution. By placing electrodes in a common external environment rather than within the sealed package, the system achieves more uniform potential distribution across multiple semiconductor chips, reducing oscillations caused by potential imbalances while maintaining high current capacity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively equalizes current flow and reduces potential imbalances, suppressing electrical oscillations and extending the device's lifespan by mitigating the negative effects of thermal expansion on electrical connections.
Implementation Method 1
a configuration of adopting a resin such as a silicone gel to the package has a problem that expansion force of the resin in high temperature generates a negative influence on an electrical connection
Data Source
AI summary
An object is to provide a technique capable of enhancing electrical characteristics and reliability of a semiconductor device. The semiconductor device includes a plurality of semiconductor chips, a plurality of electrodes each being electrically connected to each of the plurality of semiconductor chips, a sealing member, and a joint part. The sealing member covers the plurality of semiconductor chips, and parts being connected to the plurality of semiconductor chips, of the plurality of electrodes. The joint part is disposed outside the sealing member to electrically connect parts which are not covered by the sealing member, of the plurality of electrodes.